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Advances in electrical engineering research. Volume 1 /

Detalles Bibliográficos
Clasificación:Libro Electrónico
Otros Autores: Brouwer, Thomas M.
Formato: Electrónico eBook
Idioma:Inglés
Publicado: New York : Nova Science Publishers, 2011.
Colección:Advances in Electrical Engineering Research.
Temas:
Acceso en línea:Texto completo
Tabla de Contenidos:
  • ADVANCES IN ELECTRICALENGINEERING RESEARCH
  • ADVANCES IN ELECTRICALENGINEERING RESEARCH
  • CONTENTS
  • PREFACE
  • ELECTROSPRAY TECHNOLOGY FOR THIN-FILM DEVICES PRODUCTION
  • Abstract
  • 1. Introduction
  • 2. Electrospraying Fundamentals
  • 2.1. Electrospray Systems
  • 2.2. Electrospray Jet and Drop Formation
  • 2.3. Electrospray Aerosol Characterization
  • 3. Thin Solid Film Deposition
  • 3.1. Introduction
  • 3.2. Film Morphology
  • 3.3. Precursors
  • 3.4. Effect of Substrate Temperature
  • 3.5. Effect of Substrate Material
  • 3.6. Effect of Solvent Properties and Precursor Concentration 3.7. Effect of Deposition Time and Flow Rate
  • 4. Thin Solid Film Devices
  • 4.1. Solar Cells
  • 4.2. Fuel Cells
  • 4.3. Lithium Batteries
  • 4.4. Electrochemical Capacitors (Supercapacitors)
  • 4.5. Gas Sensors
  • Nomenclature
  • References
  • RECENT ADVANCES IN FLEXIBLE ORGANIC LIGHT-EMITTING DEVICES
  • Abstract
  • 1. Introduction
  • 2. Device Architectures
  • 3. Substrates and Anode
  • 3.1. Substrate Materials
  • 3.1.1. Ultrathin Glass: Wonderful Transmittance but Fragile 3.1.2. Metal Foils: Good Flexibility, Poor Surface Morphology and Opacity
  • 3.1.3. Polymer Substrates: Dimensional Stability Is One of the Biggest Challenges
  • 3.1.4. Emerging Novel Substrates
  • 3.2. Electrodes
  • 3.2.1. Metal: Perfect Conduction, but Poor Transmittance
  • 3.2.2. Metallic Oxide: Good Conduction and Transmittance, but Poor Flexibility
  • 3.2.3. Polymer or Plastic: Designable, Reproducible and Low Cost
  • 3.2.4. Carbon Nanotubes: Good Conductivity, High Transmittance and Flexibility
  • 4. Materials 4.1. Hole-Injection Materials
  • 4.2. Hole-Transport Materials
  • 4.3. Electroluminescent Materials
  • 4.4. Electron-Injection Materials and Electron-Transport Materials
  • 5. Encapsulation Methods
  • 5.1. Barrier-Coated Flexible Lid Encapsulation
  • 5.2. Thin Film Encapsulation
  • 5.2.1. Single-Layer Thin Film Encapsulation
  • 5.2.2. Multilayer Thin Film Encapsulation
  • 5.3. Hybrid Encapsulation
  • 6. Manufacturing Technologies
  • 6.1. Ink-Jet Printing
  • 6.2. Roll-to-R Roll Printin ng
  • 6.3. Screen P Printing
  • 6.4. Novel Manufacturing Technology 6.4.1. Molecular Jet Printing
  • 6.4.2. Peel-off Technique
  • 7. Summary and Outlook
  • Acknowledgment
  • Reference
  • LIQUID CRYSTALS DISPLAY TECHNIQUES AND THEIR VARIOUS APPLICATIONS INTO DISPLAY INDUSTRY
  • Abstract
  • I. Introduction
  • II. Types of Liquid Crystal Displays
  • (i) Active Matrix Liquid Crystal Display (AMLCD)
  • (ii) Passive Matrix Liquid Crystal Display (PMLCD)
  • III. Liquid Crystal (LC) Display Modes
  • (i) Twisted Nemtic LCDs
  • (ii) Super-Twisted Nemtic LCDs