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|a Microelectronics failure analysis :
|b desk reference /
|c edited by Richard J. Ross ; EDFAS, ASM International.
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|a Microelectronics failure analysis desk reference
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| 250 |
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|a 6th ed.
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| 260 |
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|a Materials Park, Ohio :
|b ASM International,
|c ©2011.
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|a 1 online resource (xi, 660 pages) :
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|a "ASM International, 2011, no. 09110Z"--Page 4 of cover
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|
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|a Some online versions lack accompanying media packaged with the printed version.
|
| 504 |
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|a Includes bibliographical references and indexes.
|
| 588 |
0 |
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|a Print version record.
|
| 505 |
0 |
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|a Section 1. Introduction -- section 2. Failure analysis process overviews -- section 3. Failure analysis topics -- section 4. Fault verification and classification -- section 5. Localization techniques -- section 6. Deprocessing and sample preparation -- section 7. Inspection -- section 8. Materials analysis -- section 9. Focused ion beam applications -- section 10. Management and reference information.
|
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|a eBooks on EBSCOhost
|b EBSCO eBook Subscription Academic Collection - Worldwide
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0 |
|a Microelectronics
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|x Testing
|v Handbooks, manuals, etc.
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| 650 |
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0 |
|a Microelectronics
|x Defects
|x Testing
|v Handbooks, manuals, etc.
|
| 650 |
|
0 |
|a Electronic apparatus and appliances
|x Testing
|v Handbooks, manuals, etc.
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| 650 |
|
0 |
|a Electronics
|x Materials
|x Testing
|v Handbooks, manuals, etc.
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| 650 |
|
0 |
|a Electronics
|x Materials
|x Defects
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|a Ross, Richard J.
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|a ASM International.
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|a Electronic Device Failure Analysis Society.
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|i Print version:
|t Microelectronics failure analysis.
|b 6th ed.
|d Materials Park, Ohio : ASM International, ©2011
|z 161503725X
|w (OCoLC)701026679
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