ISTFA 2007 : proceedings of the 33rd International Symposium for Testing and Failure Analysis, November 4-8, 2007, San Jose McEnery Convention Center, San Jose, California, USA /

Detalles Bibliográficos
Clasificación:Libro Electrónico
Autores Corporativos: International Symposium for Testing and Failure Analysis San Jose, Calif., ASM International, Electronic Device Failure Analysis Society
Formato: Electrónico Congresos, conferencias eBook
Idioma:Inglés
Publicado: Materials Park, OH : ASM International, ©2007.
Temas:
Electronics > Materials > Testing > Congresses.
Electronic apparatus and appliances > Testing > Congresses.
Appareils électroniques > Essais > Congrès.
TECHNOLOGY & ENGINEERING > Electronics > Circuits > General.
TECHNOLOGY & ENGINEERING > Electronics > Circuits > Integrated.
Electronic apparatus and appliances > Testing.
Electronics > Materials > Testing.
Conference papers and proceedings.
Acceso en línea:Texto completo
Tabla de Contenidos:
  • Contents
  • Session 1: Emerging Concepts
  • Session 2: Circuit Edit 1
  • Session 3: SPM Techniques
  • Session 4: Sample Preparation
  • Session 5: Photon Based Techniques
  • Session 6: In-Line Metrology and Inspection
  • Session 7: Package and Assembly Level FA 1
  • Session 8: Posters
  • Session 9: Package and Assembly Level FA 2
  • Session 10: Nanoprobing
  • Session 11: Package and Assembly Level FA 3
  • Session 12: Failure Analysis Process 1
  • Session 13: Yield Enhancement
  • Session 14: System Level Analysis and Test
  • Session 15: Circuit Edit 2

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