ISTFA 2006 : Proceedings of the 32nd International Symposium for Testing and Failure Analysis, November 12-16, 2006, Renaissance Austin Hotel, Austin, Texas, USA /

Detalles Bibliográficos
Clasificación:Libro Electrónico
Autores Corporativos: International Symposium for Testing and Failure Analysis Austin, Tex., Electronic Device Failure Analysis Society, ASM International
Formato: Electrónico Congresos, conferencias eBook
Idioma:Inglés
Publicado: Materials Park, OH : ASM International, 2006.
Temas:
Electronics > Materials > Testing > Congresses.
Electronic apparatus and appliances > Testing > Congresses.
Materials > Testing > Congresses.
Appareils électroniques > Essais > Congrès.
Matériaux > Essais > Congrès.
TECHNOLOGY & ENGINEERING > Electronics > Circuits > General.
TECHNOLOGY & ENGINEERING > Electronics > Circuits > Integrated.
Electronic apparatus and appliances > Testing.
Electronics > Materials > Testing.
Materials > Testing.
Conference papers and proceedings.
Acceso en línea:Texto completo
Tabla de Contenidos:
  • Contents
  • Session 1: Advanced Techniques 1
  • Near-field scanning microwave probe for rapid detection of non-visual and parametric defects in Cu/low- k interconnect on production wafers
  • Non-invasive acoustic phonon characterization of dynamic MEMS
  • Magnetic current imaging with magnetic tunnel junction sensors: case study and analysis
  • Session 2: System Level Analysis 1
  • Analysis and Identification of Off-Odor Compounds in Electronic Systems
  • System Failure Analysis Process and Case Study
  • Using a Unified Data Stream to drive Failure Analysis for Product Improvement in the Personal Computer (PC) EnvironmentSession 3: Test and Diagnostics
  • Triangulating to a Defect's Physical Coordinates Using Multiple Supply Pad IDDQs: Test Chip Results
  • Logical-to-physical Device Navigation using Place-and-Route Data as an Alternative to LVS
  • Fundamental Considerations for CDM failure in 90nm Products
  • Session 4: Circuit Edit and Beam-Based Sample Preparation
  • Development of a Circuit Edit Process Scalable in Dimension and Material
  • Quantitative electrical analysis of FIB prepared vias on BiCMOS and CMOS090 designsStudy on the Effect of FIB Electron Beam Assisted Platinum Deposition on TEM Sample Analysis
  • Experiment study on Crystal/Amorphous Structure of TEM Samples Prepared by FIB Milling
  • Advanced Fringe Analysis Techniques in Circuit Edit
  • Session 5: Scanning Probe Microscopy
  • Direct Measurements of Charge in Floating Gate Transistor Channels of Flash Memories Using Scanning Capacitance Microscopy
  • Development of Backside Scanning Capacitance Microscopy Technique for Advanced SOI MicroprocessorsMaterial and doping contrast in semiconductor devices at nanoscale resolution using scattering- type scanning near-field optical microscopy
  • Identification of Root Cause Failure in Silicon on Insulator Body Contacted nFETs using Scanning Capacitance Microscopy and Scanning Spreading Resistance Microscopy
  • Session 7: Package Level Analysis 1
  • Intermittent Failures in High Pin Count Packaging
  • Microstructure Analysis of Wafer Bump Nodule
  • Packaging Material has contributed to high Idd_Pd failures in CMOS ICsSession 8: Discretes, Passives, MEMS, and Optoelectronics
  • Inductive Operating Life Stress Metal Breakdown Mechanism
  • Root Cause finding of a Diode Leakage Failure using Scanning Magnetic Microscopy and ToF-SIMS as Key Methods
  • Temperature and Humidity Dependent Reliability Analysis of RGB LED Chips
  • A Study of Low Leakage Failure Mechanism of X7R Multiple Layer Ceramic Capacitor (MLCC)
  • A System for Electro-Mechanical Reliability Testing of MEMS Devices
  • Section 9: Posters

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