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|a International Symposium for Testing and Failure Analysis
|n (23rd :
|d 2006 :
|c Austin, Tex.)
|
| 245 |
1 |
0 |
|a ISTFA 2006 :
|b Proceedings of the 32nd International Symposium for Testing and Failure Analysis, November 12-16, 2006, Renaissance Austin Hotel, Austin, Texas, USA /
|c sponsored by EDFAS--Electronic Device Failure Analysis Society, ISTFA/2006, ASM International.
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| 246 |
3 |
0 |
|a Proceedings of the 32nd International Symposium for Testing and Failure Analysis
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| 246 |
3 |
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|a Conference proceedings from the 32nd International Symposium for Testing and Failure Analysis
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| 260 |
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|a Materials Park, OH :
|b ASM International,
|c 2006.
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| 300 |
|
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|a 1 online resource (xx, 524 pages) :
|b illustrations
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| 336 |
|
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|a text
|b txt
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|a Includes bibliographical references and index.
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| 588 |
0 |
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|a Print version record.
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0 |
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|a Contents -- Session 1: Advanced Techniques 1 -- Near-field scanning microwave probe for rapid detection of non-visual and parametric defects in Cu/low- k interconnect on production wafers -- Non-invasive acoustic phonon characterization of dynamic MEMS -- Magnetic current imaging with magnetic tunnel junction sensors: case study and analysis -- Session 2: System Level Analysis 1 -- Analysis and Identification of Off-Odor Compounds in Electronic Systems -- System Failure Analysis Process and Case Study
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| 505 |
8 |
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|a Using a Unified Data Stream to drive Failure Analysis for Product Improvement in the Personal Computer (PC) EnvironmentSession 3: Test and Diagnostics -- Triangulating to a Defect's Physical Coordinates Using Multiple Supply Pad IDDQs: Test Chip Results -- Logical-to-physical Device Navigation using Place-and-Route Data as an Alternative to LVS -- Fundamental Considerations for CDM failure in 90nm Products -- Session 4: Circuit Edit and Beam-Based Sample Preparation -- Development of a Circuit Edit Process Scalable in Dimension and Material
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| 505 |
8 |
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|a Quantitative electrical analysis of FIB prepared vias on BiCMOS and CMOS090 designsStudy on the Effect of FIB Electron Beam Assisted Platinum Deposition on TEM Sample Analysis -- Experiment study on Crystal/Amorphous Structure of TEM Samples Prepared by FIB Milling -- Advanced Fringe Analysis Techniques in Circuit Edit -- Session 5: Scanning Probe Microscopy -- Direct Measurements of Charge in Floating Gate Transistor Channels of Flash Memories Using Scanning Capacitance Microscopy
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| 505 |
8 |
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|a Development of Backside Scanning Capacitance Microscopy Technique for Advanced SOI MicroprocessorsMaterial and doping contrast in semiconductor devices at nanoscale resolution using scattering- type scanning near-field optical microscopy -- Identification of Root Cause Failure in Silicon on Insulator Body Contacted nFETs using Scanning Capacitance Microscopy and Scanning Spreading Resistance Microscopy -- Session 7: Package Level Analysis 1 -- Intermittent Failures in High Pin Count Packaging -- Microstructure Analysis of Wafer Bump Nodule
|
| 505 |
8 |
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|a Packaging Material has contributed to high Idd_Pd failures in CMOS ICsSession 8: Discretes, Passives, MEMS, and Optoelectronics -- Inductive Operating Life Stress Metal Breakdown Mechanism -- Root Cause finding of a Diode Leakage Failure using Scanning Magnetic Microscopy and ToF-SIMS as Key Methods -- Temperature and Humidity Dependent Reliability Analysis of RGB LED Chips -- A Study of Low Leakage Failure Mechanism of X7R Multiple Layer Ceramic Capacitor (MLCC) -- A System for Electro-Mechanical Reliability Testing of MEMS Devices -- Section 9: Posters
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| 590 |
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|a eBooks on EBSCOhost
|b EBSCO eBook Subscription Academic Collection - Worldwide
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|a Electronics
|x Materials
|x Testing
|v Congresses.
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| 650 |
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0 |
|a Electronic apparatus and appliances
|x Testing
|v Congresses.
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| 650 |
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0 |
|a Materials
|x Testing
|v Congresses.
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| 650 |
|
6 |
|a Appareils électroniques
|x Essais
|v Congrès.
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| 650 |
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6 |
|a Matériaux
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|v Congrès.
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| 650 |
|
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|a TECHNOLOGY & ENGINEERING
|x Electronics
|x Circuits
|x General.
|2 bisacsh
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| 650 |
|
7 |
|a TECHNOLOGY & ENGINEERING
|x Electronics
|x Circuits
|x Integrated.
|2 bisacsh
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| 650 |
|
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|a Electronic apparatus and appliances
|x Testing.
|2 fast
|0 (OCoLC)fst00906837
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| 650 |
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|x Materials
|x Testing.
|2 fast
|0 (OCoLC)fst00907571
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|x Testing.
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|2 fast
|0 (OCoLC)fst01423772
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| 710 |
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|a Electronic Device Failure Analysis Society.
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| 710 |
2 |
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|a ASM International.
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| 776 |
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|z 0871708442
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