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| LEADER |
00000cam a2200000Ia 4500 |
| 001 |
EBSCO_ocn646817812 |
| 003 |
OCoLC |
| 005 |
20231017213018.0 |
| 006 |
m o d |
| 007 |
cr cnu---unuuu |
| 008 |
971126s1997 ohua ob 101 0 eng d |
| 040 |
|
|
|a E7B
|b eng
|e pn
|c E7B
|d OCLCQ
|d N$T
|d OCLCQ
|d OCLCF
|d OCLCO
|d YDXCP
|d OCL
|d OCLCO
|d EBLCP
|d OCLCO
|d OCLCQ
|d OCLCO
|d OCLCQ
|d OCLCO
|d OCLCQ
|d OCLCO
|d AGLDB
|d MOR
|d ZCU
|d MERUC
|d OCLCQ
|d U3W
|d STF
|d WRM
|d VTS
|d COCUF
|d ICG
|d INT
|d VT2
|d OCLCQ
|d DKC
|d OCLCQ
|d M8D
|d OCLCQ
|d UKCRE
|d AJS
|d OCLCQ
|d OCLCO
|d OCLCQ
|
| 019 |
|
|
|a 923570479
|a 929147735
|a 961676198
|a 962619385
|a 988409900
|a 992031202
|a 1037927344
|a 1038635780
|a 1045503180
|a 1055332276
|a 1058990640
|a 1081291541
|a 1097151692
|a 1153523802
|a 1228613966
|
| 020 |
|
|
|a 9781615030828
|q (electronic bk.)
|
| 020 |
|
|
|a 1615030824
|q (electronic bk.)
|
| 020 |
|
|
|a 9780871706195
|q (electronic bk.)
|
| 020 |
|
|
|a 0871706199
|q (electronic bk.)
|
| 029 |
1 |
|
|a AU@
|b 000051416663
|
| 029 |
1 |
|
|a DEBBG
|b BV043070315
|
| 029 |
1 |
|
|a DEBBG
|b BV044182338
|
| 029 |
1 |
|
|a DEBSZ
|b 421523190
|
| 029 |
1 |
|
|a NZ1
|b 15322519
|
| 035 |
|
|
|a (OCoLC)646817812
|z (OCoLC)923570479
|z (OCoLC)929147735
|z (OCoLC)961676198
|z (OCoLC)962619385
|z (OCoLC)988409900
|z (OCoLC)992031202
|z (OCoLC)1037927344
|z (OCoLC)1038635780
|z (OCoLC)1045503180
|z (OCoLC)1055332276
|z (OCoLC)1058990640
|z (OCoLC)1081291541
|z (OCoLC)1097151692
|z (OCoLC)1153523802
|z (OCoLC)1228613966
|
| 050 |
|
4 |
|a TK7871.85
|b .I57775 1997eb
|
| 072 |
|
7 |
|a TEC
|x 008010
|2 bisacsh
|
| 072 |
|
7 |
|a TEC
|x 008020
|2 bisacsh
|
| 082 |
0 |
4 |
|a 621.3815/48
|2 23
|
| 049 |
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|a UAMI
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|a International Symposium for Testing and Failure Analysis
|n (23rd :
|d 1997 :
|c Santa Clara, Calif.)
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1 |
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|a ISTFA '97 :
|b proceedings of the 23rd International Symposium for Testing and Failure Analysis : 27-31 October, 1997, Santa Clara Convention center, Santa Clara, California /
|c sponsored by ASM International.
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3 |
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|a 23rd international symposium for testing and failure analysis
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|a Materials Park, OH :
|b ASM International,
|c ©1997.
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| 300 |
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|a 1 online resource (xix, 346 pages) :
|b illustrations
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| 336 |
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|a text
|b txt
|2 rdacontent
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|a computer
|b c
|2 rdamedia
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| 338 |
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|a online resource
|b cr
|2 rdacarrier
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| 504 |
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|a Includes bibliographical references and index.
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|a Print version record.
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|a Preface -- Table of Contents -- 24th International Symposium for Testing and Failure Analysis -- 25th International Symposium for Testing and Failure Analysis -- 24th International Symposium for Testing and Failure Analysis â€Ø ISTFA ' 98 -- Experimental Figures for the Defect Coverage of looaVectors -- A CAD- Based Approach to Failure Diagnosis of CMOSLSI with Single Fault Using Abnormal IOOQ -- Test and Failure Analysis Implications of a Novel Inter-Bit Dependency in a Non- Volatile Memory -- Analysis of a Latent Deep Submicron CMOS Device Isolation Leakage Mechanism
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|a Scanning Fluorescent Microthermal ImagingTemperature Profiling with Highest Spatial and Temperature Resolution by Means of Scanning Thermal Microscopy (SThM) -- Thermal and Optical Enhancements to Liquid Crystal Hot Spot Detection Methods -- Application of Ba~kside Photo and Thermal Emission Microscopy Techniques to Advanced Memory Devices -- Cross Sectioning with a Pivoting Sample Block -- Gain Reduction in Silicon Phototransistors Induced by Metallization Mask Misalignment -- Comparison Precision XTEM Specimen Preparation Techniques for Semiconductor Failure Analysis
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|a Temperature-Dependent Electronic Circuit Analogy for Predicting Wire Temperature as a Function of CurrentThe Application of FIB Voltage-Contrast Technique Combining with TEM on Subtle Defect Analysis: Via Delamination After TC -- The Usage of Focused Ion Beam Induced Deposition of Gold Film in Ie Device Modification and Repair -- Failure Analysis Challenges of Surface Micromachined Accelerometers -- Failure Analysis for Micro-Electrical- Mechanical Systems (MEMS)
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| 505 |
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|a Investigation of Multi- Level Metallization ULSls by Light Emission from the Back- Side and Front- Side of the ChipA Simple, Cost Effective, and Very Sensitive Alternative for Photon Emission Spectroscopy -- Novel Failure Analysis Technique Light Induced State Transition (LIST) Method Using an OBIC System -- An Application of Breakthrough Failure Analysis Techniques in Eliminating Silicon Dislocation Problem in Sub-Micron CMOS Devices -- Characterization of Californium -- 252 (2s2Cf) as a Laboratory Source of Radiation for Testing and Analysis of Semiconductor Devices
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|a Dendritic Growth Failure of a Mesa DiodeInterpretation of Sudden Failures in Pump Laser Diodes -- Through- Transmission Acoustic Inspection of Ball Grid Array (BGA) Packages -- Moisture Detection Method in Ceramic Package by Slight Current Measurement -- Laser Microchemical Technology: NewTools for Flip- Chip Debug and Failure Analysis -- Single Contact Electron Beam Induced Current Microscopy for Failure Analysis of Integrated Circuits -- Electrical and Chemical Characterization of FIB- Deposited Insulators
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| 590 |
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|a eBooks on EBSCOhost
|b EBSCO eBook Subscription Academic Collection - Worldwide
|
| 650 |
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0 |
|a Electronics
|x Materials
|x Testing
|v Congresses.
|
| 650 |
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0 |
|a Electronic apparatus and appliances
|x Testing
|v Congresses.
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| 650 |
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6 |
|a Appareils électroniques
|x Essais
|v Congrès.
|
| 650 |
|
7 |
|a TECHNOLOGY & ENGINEERING
|x Electronics
|x Circuits
|x General.
|2 bisacsh
|
| 650 |
|
7 |
|a TECHNOLOGY & ENGINEERING
|x Electronics
|x Circuits
|x Integrated.
|2 bisacsh
|
| 650 |
|
7 |
|a Electronic apparatus and appliances
|x Testing.
|2 fast
|0 (OCoLC)fst00906837
|
| 650 |
|
7 |
|a Electronics
|x Materials
|x Testing.
|2 fast
|0 (OCoLC)fst00907571
|
| 655 |
|
7 |
|a Conference papers and proceedings.
|2 fast
|0 (OCoLC)fst01423772
|
| 700 |
1 |
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|a Davidson, Grace M.
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| 710 |
2 |
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|a ASM International.
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| 776 |
0 |
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|i Print version:
|a Davison, Grace M.
|t ISTFA '97 : Proceedings of the 23rd International Symposium for Testing and Failure Analysis.
|d Materials Park : A S M International, ©1997
|z 9780871706195
|
| 856 |
4 |
0 |
|u https://ebsco.uam.elogim.com/login.aspx?direct=true&scope=site&db=nlebk&AN=395816
|z Texto completo
|
| 938 |
|
|
|a ebrary
|b EBRY
|n ebr10323496
|
| 938 |
|
|
|a EBSCOhost
|b EBSC
|n 395816
|
| 938 |
|
|
|a YBP Library Services
|b YANK
|n 3623542
|
| 994 |
|
|
|a 92
|b IZTAP
|
