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Integrated interconnect technologies for 3D nanoelectronic systems /
This cutting-edge book on off-chip technologies puts the hottest breakthroughs in high-density compliant electrical interconnects, nanophotonics, and microfluidics at your fingertips, integrating the full range of mathematics, physics, and technology issues together in a single comprehensive source.
| Clasificación: | Libro Electrónico |
|---|---|
| Otros Autores: | , |
| Formato: | Electrónico eBook |
| Idioma: | Inglés |
| Publicado: |
Boston, Mass. ; London :
Artech House,
©2009.
|
| Colección: | Artech House integrated microsystems series.
|
| Temas: | |
| Acceso en línea: | Texto completo |
MARC
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| 245 | 0 | 0 | |a Integrated interconnect technologies for 3D nanoelectronic systems / |c Muhannad S. Bakir, James D. Meindl, editors. |
| 260 | |a Boston, Mass. ; |a London : |b Artech House, |c ©2009. | ||
| 300 | |a 1 online resource (xx, 528 pages) : |b illustrations | ||
| 336 | |a text |b txt |2 rdacontent | ||
| 337 | |a computer |b c |2 rdamedia | ||
| 338 | |a online resource |b cr |2 rdacarrier | ||
| 490 | 1 | |a Artech House integrated microsystems series | |
| 504 | |a Includes bibliographical references and index. | ||
| 588 | 0 | |a Print version record. | |
| 505 | 0 | |a Integrated Interconnect Technologies for 3D Nanoelectronic Systems; Contents; Foreword; Preface; Chapter 1: Revolutionary Silicon AncillaryTechnologies for the Next Era of Gigascale Integration; Chapter 2: Chip-Package Interaction and Reliability Impact on Cu/Low-k Interconnects; Chapter 3: Mechanically Compliant I/O Interconnects and Packaging; Chapter 4: Power Delivery to Silicon; Chapter 5: On-Chip Power Supply Noise Modeling for Gigascale 2D and 3D Systems; Chapter 6: Off-Chip Signaling; Chapter 7: Optical Interconnects for Chip-to-Chip Signaling. | |
| 520 | |a This cutting-edge book on off-chip technologies puts the hottest breakthroughs in high-density compliant electrical interconnects, nanophotonics, and microfluidics at your fingertips, integrating the full range of mathematics, physics, and technology issues together in a single comprehensive source. | ||
| 590 | |a eBooks on EBSCOhost |b EBSCO eBook Subscription Academic Collection - Worldwide | ||
| 650 | 0 | |a Interconnects (Integrated circuit technology) | |
| 650 | 0 | |a Telecommunication systems. | |
| 650 | 0 | |a Nanoelectronics. | |
| 650 | 6 | |a Interconnexions (Technologie des circuits intégrés) | |
| 650 | 6 | |a Systèmes de télécommunications. | |
| 650 | 6 | |a Nanoélectronique. | |
| 650 | 7 | |a telecommunication systems. |2 aat | |
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| 650 | 7 | |a TECHNOLOGY & ENGINEERING |x Electronics |x Digital. |2 bisacsh | |
| 650 | 7 | |a Interconnects (Integrated circuit technology) |2 fast | |
| 650 | 7 | |a Nanoelectronics |2 fast | |
| 650 | 7 | |a Telecommunication systems |2 fast | |
| 700 | 1 | |a Bakir, Muhannad S. | |
| 700 | 1 | |a Meindl, James D., |d 1933-2020. | |
| 776 | 0 | 8 | |i Print version: |t Integrated interconnect technologies for 3D nanoelectronic systems. |d Boston, Mass. ; London : Artech House, ©2009 |z 9781596932463 |z 1596932465 |w (OCoLC)302063121 |
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