Integrated interconnect technologies for 3D nanoelectronic systems /

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This cutting-edge book on off-chip technologies puts the hottest breakthroughs in high-density compliant electrical interconnects, nanophotonics, and microfluidics at your fingertips, integrating the full range of mathematics, physics, and technology issues together in a single comprehensive source.

Detalles Bibliográficos
Clasificación:Libro Electrónico
Otros Autores: Bakir, Muhannad S., Meindl, James D., 1933-2020
Formato: Electrónico eBook
Idioma:Inglés
Publicado: Boston, Mass. ; London : Artech House, ©2009.
Colección:Artech House integrated microsystems series.
Temas:
Interconnects (Integrated circuit technology)
Telecommunication systems.
Nanoelectronics.
Interconnexions (Technologie des circuits intégrés)
Systèmes de télécommunications.
Nanoélectronique.
telecommunication systems.
TECHNOLOGY & ENGINEERING > Electronics > Microelectronics.
TECHNOLOGY & ENGINEERING > Electronics > Digital.
Nanoelectronics
Telecommunication systems
Acceso en línea:Texto completo
Descripción
Sumario:This cutting-edge book on off-chip technologies puts the hottest breakthroughs in high-density compliant electrical interconnects, nanophotonics, and microfluidics at your fingertips, integrating the full range of mathematics, physics, and technology issues together in a single comprehensive source.
Descripción Física:1 online resource (xx, 528 pages) : illustrations
Bibliografía:Includes bibliographical references and index.
ISBN:9781596932470
1596932473

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