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EBSCO_ocn297826771 |
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OCoLC |
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20231017213018.0 |
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m o d |
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cr cnu---unuuu |
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090109s2004 ohua obf 001 0 eng d |
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|a OCLCE
|b eng
|e pn
|c OCLCE
|d OCLCQ
|d E7B
|d OCLCQ
|d COO
|d B24X7
|d N$T
|d OCLCQ
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|d EBLCP
|d OCLCQ
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|d STF
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|d OCLCQ
|d OCLCO
|d OCLCQ
|d OCLCO
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|a 762079349
|a 765135785
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|a 9781615032662
|q (electronic bk.)
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|a 1615032665
|q (electronic bk.)
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|z 9780871708045
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|z 0871708043
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|a AU@
|b 000062642933
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|a DEBBG
|b BV043114377
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|a DEBSZ
|b 421522674
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|a (OCoLC)297826771
|z (OCoLC)762079349
|z (OCoLC)765135785
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|a TK7871
|b .M52 2004
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|a TEC
|x 008010
|2 bisacsh
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|a TEC
|x 008020
|2 bisacsh
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|a 621.381548
|2 22
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|a UAMI
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|a Microelectronics failure analysis :
|b desk reference /
|c edited by the Electronic Device Failure Analysis Society, Desk Reference Committee.
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|a Materials Park, Ohio :
|b ASM International,
|c ©2004.
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300 |
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|a 1 online resource (xiv, 800 pages) :
|b illustrations
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336 |
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|a text
|b txt
|2 rdacontent
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|a computer
|b c
|2 rdamedia
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|a online resource
|b cr
|2 rdacarrier
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|a Includes bibliographical references and indexes.
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0 |
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|g Introduction --
|t Failure analysis process flow --
|t Failure verification --
|t Failure mode: failure classifications --
|t Special devices --
|t Non-destructive analysis techniques --
|t Depackaging --
|t Photon emission (electroluminescence) localization techniques --
|t Microthermography --
|t Laser and particle beam-based localization techniques --
|t Deprocessing --
|t General imaging techniques --
|t Local deprocessing and imaging --
|t Materials analysis techniques --
|t Important topics for semiconductor devices --
|t FA techniques/tools roadmaps --
|t FA operation and management --
|g Appendix.
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|a Print version record.
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|a eBooks on EBSCOhost
|b EBSCO eBook Subscription Academic Collection - Worldwide
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650 |
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|a Microelectronics
|x Materials
|x Testing
|v Handbooks, manuals, etc.
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650 |
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0 |
|a Microelectronics
|x Defects
|x Testing
|v Handbooks, manuals, etc.
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650 |
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0 |
|a Electronic apparatus and appliances
|x Testing
|v Handbooks, manuals, etc.
|
650 |
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0 |
|a Electronics
|x Materials
|x Testing
|v Handbooks, manuals, etc.
|
650 |
|
0 |
|a Electronics
|x Materials
|x Defects
|v Handbooks, manuals, etc.
|
650 |
|
0 |
|a Electronics
|x Materials
|v Handbooks, manuals, etc.
|
650 |
|
6 |
|a Appareils électroniques
|x Essais
|v Guides, manuels, etc.
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650 |
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6 |
|a Électronique
|x Matériaux
|v Guides, manuels, etc.
|
650 |
|
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|a TECHNOLOGY & ENGINEERING
|x Electronics
|x Circuits
|x General.
|2 bisacsh
|
650 |
|
7 |
|a TECHNOLOGY & ENGINEERING
|x Electronics
|x Circuits
|x Integrated.
|2 bisacsh
|
650 |
|
7 |
|a Electronic apparatus and appliances
|x Testing
|2 fast
|
650 |
|
7 |
|a Electronics
|x Materials
|x Defects
|2 fast
|
650 |
|
7 |
|a Electronics
|x Materials
|x Testing
|2 fast
|
650 |
|
7 |
|a Microelectronics
|x Materials
|x Testing
|2 fast
|
655 |
|
7 |
|a handbooks.
|2 aat
|
655 |
|
7 |
|a Handbooks and manuals
|2 fast
|
655 |
|
7 |
|a Handbooks and manuals.
|2 lcgft
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655 |
|
7 |
|a Guides et manuels.
|2 rvmgf
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710 |
2 |
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|a Electronic Device Failure Analysis Society.
|b Desk Reference Committee.
|
710 |
2 |
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|a ASM International.
|
776 |
0 |
8 |
|i Print version:
|t Microelectronics failure analysis.
|d Materials Park, Ohio : ASM International, ©2004
|w (OCoLC)57017140
|
856 |
4 |
0 |
|u https://ebsco.uam.elogim.com/login.aspx?direct=true&scope=site&db=nlebk&AN=395872
|z Texto completo
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|a ebrary
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|b EBSC
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