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Compound semiconductor integrated circuits /
Annotation Book version of a special issue of the International Journal of High Speed Electronics and Systems, reviewing recent work in the field of compound semiconductor integrated circuits.
| Clasificación: | Libro Electrónico |
|---|---|
| Otros Autores: | |
| Formato: | Electrónico eBook |
| Idioma: | Inglés |
| Publicado: |
River Edge, NJ :
World Scientific Pub.,
©2003.
|
| Colección: | Selected topics in electronics and systems ;
v. 29. |
| Temas: | |
| Acceso en línea: | Texto completo |
Tabla de Contenidos:
- Preface; CONTENTS; Present and Future of High-Speed Compound Semiconductor IC's; 1. Introduction; 2. Fundamentals of Lightwave Communication ICs; 3. Device Technology; 4. Fundamentals of High-Speed Digital IC Design; 5. Mixed Signal Issues in High Speed IC Design; 6. Future Trends and Subjects; 7. Conclusions; References; A Comparison of Silicon and III-V Technology Performance and Building Block Implementations for 10 and 40 Gb/s Optical Networking ICs; 1. Introduction; 2. Semiconductor Technologies; 3. Building Blocks; 4. Technology Choices; 5. Examples of 10 and 40 Gb/s Circuits.
- 6. ConclusionsReferences; The Transforming MMIC; 1. Introduction; 2. Transforming MMICs through Innovations in Compound Semiconductor Materials; 3. Transforming Architectures for Real-time Adaptability; 4. Conclusions; Reference; Metamorphic Low Noise Amplifiers and Optical Components; 1. Introduction; 2. Material Properties; 3. Device Processing and Low Noise DC Performance; 4. Low Noise Devices And Circuits; 5. Power Devices; 6. Metamorphic Optical Devices and Circuits; 7. Reliability; 8. Conclusion; References; GaAs PHEMT Chip Sets and IC Processes for High-End Fiber Optic Applications.
- 1. Introduction2. PHEMT and MHEMT Processes; 3. Optical Fibre Interface Circuits; 4. 2.5 Gb/s Transimpedance Amplifiers; 5. 40Gb/s Transimpedance Amplifier; 6.10 Gb/s Laser Drivers; 7. 40Gb/s Modulator Drivers; 8.43 Gb/s Multiplexers and Demultiplexers; 9. Future Performance of Fiber Optic IC's and Related Processes; 10. Conclusion; References; Distributed Amplifier for Fiber-Optic Communication Systems; 1. Introduction; 2. Conventional Distributed Amplifier Design; 3. LiNbO3 Modulator Driver (LNDRV); 4. NRZ-Preamplifier; 5. RZ-Preamplifler; 6. Over-40-Gb/s amplifier; 7. Conclusion.
- 3. Trench Photodiodes4. Key Passive Elements for High-Frequency Operation; 5. Substrate Effects in RF and Microwave IC Designs; 6. Summary; References; High-Speed Low-Power Digital and Analog Circuits Implemented in IBM SiGe BiCMOS Technology; 1. Introduction; 2. Circuit design methodology; 3. Measured performance results from the first 5HP fabrication run; 4. Measured performance results from the second 5HP fabrication run; 5. Measured and simulated performance results on the first 7HP fabrication run; 6. Circuits placed on second 7HP fabrication run; 7. SiGe BiCMOS applications; 8. Summary.