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Adaptive cooling of integrated circuits using digital microfluidics /

Thanks to increasing power consumption and component density, localized?hot spots? are becoming a serious challenge in IC (integrated circuit) chip design? so serious, in fact, that Intel recently had to yank a circuit because it was literally burning. For IC engineers grappling with high power diss...

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Detalles Bibliográficos
Clasificación:Libro Electrónico
Autor principal: Paik, Philip Y.
Otros Autores: Chakrabarty, Krishnendu, Pamula, Vamsee K.
Formato: Electrónico eBook
Idioma:Inglés
Publicado: Norwood, Mass. : Artech House, ©2007.
Colección:Artech House integrated microsystems series.
Temas:
Acceso en línea:Texto completo
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por Paik, Philip Y.
Publicado 2007
Texto completo
Electrónico eBook