Adaptive cooling of integrated circuits using digital microfluidics /
Thanks to increasing power consumption and component density, localized?hot spots? are becoming a serious challenge in IC (integrated circuit) chip design? so serious, in fact, that Intel recently had to yank a circuit because it was literally burning. For IC engineers grappling with high power diss...
Clasificación: | Libro Electrónico |
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Autor principal: | Paik, Philip Y. |
Otros Autores: | Chakrabarty, Krishnendu, Pamula, Vamsee K. |
Formato: | Electrónico eBook |
Idioma: | Inglés |
Publicado: |
Norwood, Mass. :
Artech House,
©2007.
|
Colección: | Artech House integrated microsystems series.
|
Temas: | |
Acceso en línea: | Texto completo |
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