Adaptive cooling of integrated circuits using digital microfluidics /

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Thanks to increasing power consumption and component density, localized?hot spots? are becoming a serious challenge in IC (integrated circuit) chip design? so serious, in fact, that Intel recently had to yank a circuit because it was literally burning. For IC engineers grappling with high power diss...

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Detalles Bibliográficos
Clasificación:Libro Electrónico
Autor principal: Paik, Philip Y.
Otros Autores: Chakrabarty, Krishnendu, Pamula, Vamsee K.
Formato: Electrónico eBook
Idioma:Inglés
Publicado: Norwood, Mass. : Artech House, ©2007.
Colección:Artech House integrated microsystems series.
Temas:
Integrated circuits > Cooling.
Microfluidics.
Integrated circuits > Design and construction.
Microfluidique.
Circuits intégrés > Conception et construction.
TECHNOLOGY & ENGINEERING > Material Science.
Integrated circuits > Cooling
Integrated circuits > Design and construction
Microfluidics
Circuits intégrés > Refroidissement.
Microfluidique > Applications industrielles.
Acceso en línea:Texto completo
Descripción
Sumario:Thanks to increasing power consumption and component density, localized?hot spots? are becoming a serious challenge in IC (integrated circuit) chip design? so serious, in fact, that Intel recently had to yank a circuit because it was literally burning. For IC engineers grappling with high power dissipation and thermal issues, new droplet-based cooling techniques using digital microfluidics technology could provide the solution. This definitive guide paves the way, with design and implementation methodologies and prototypes for utilizing this groundbreaking technology. After reviewing cooling.
Descripción Física:1 online resource (203 pages) : illustrations
Bibliografía:Includes bibliographical references and index.
ISBN:9781596931398
1596931396

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