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Understanding smart sensors /
Here is a complete, authoritative summary of the latest applications and developments impacting smart sensors in a single volume, now updated to reflect IEEE 1451.2 smart sensor standards. Utilizing the latest in smart sensor, microelectromechanical systems (MEMS) and microelectronic research and de...
| Clasificación: | Libro Electrónico |
|---|---|
| Autor principal: | |
| Formato: | Electrónico eBook |
| Idioma: | Inglés |
| Publicado: |
Boston :
Artech House,
2000.
|
| Edición: | 2nd ed. |
| Colección: | Artech House sensors library.
|
| Temas: | |
| Acceso en línea: | Texto completo |
Tabla de Contenidos:
- Smart Sensor Basics
- Mechanical-Electronic Transitions in Sensing
- Nature of Sensors
- Integration of Micromachining and Microelectronics
- Micromachining
- Bulk Micromachining
- Wafer Bonding
- Silicon-on-Silicon Bonding
- Silicon-on-Glass (Anodic) Bonding
- Silicon Fusion Bonding
- Wafer Bonding for More Complex Structures and Adding ICs
- Surface Micromachining
- Squeeze-Film Damping
- Stiction
- Particulate Control
- Combinations of Surface and Bulk Micromachining
- Other Micromachining Techniques
- LIGA Process
- Dry-Etching Processes
- Micromilling
- Lasers in Micromachining
- Chemical Etching and IC Technology
- Other Micromachined Materials
- Diamond as an Alternative Sensor Material
- Metal Oxides and Piezoelectric Sensing
- Films on Microstructures
- Micromachining Metal Structures
- The Nature of Semiconductor Sensor Output
- Sensor Output Characteristics
- Wheatstone Bridge
- Piezoresistivity in Silicon
- Semiconductor Sensor Definitions
- Static Versus Dynamic Operation
- Other Sensing Technologies
- Capacitive Sensing
- Piezoelectric Sensing
- Hall Effect
- Chemical Sensors
- Improving Sensor Characteristics
- Digital Output Sensors
- Incremental Optical Encoders
- Digital Techniques
- Noise/Interference Aspects
- Low-Power, Low-Voltage Sensors
- Impedance
- Analysis of Sensitivity Improvement
- Thin Diaphragm
- Increased Diaphragm Area
- Combined Solution: Micromachining and Microelectronics
- Getting Sensor Information Into the MCU
- Amplification and Signal Conditioning
- Instrumentation Amplifiers
- SLEEPMODE Operational Amplifier
- Rail-to-Rail Operational Simplifiers
- Switched-Capacitor Amplifier
- Barometer Application Circuit
- 4- to 20-mA Signal Transmitter
- Schmitt Trigger
- Inherent Power-Supply Rejection
- Separate Versus Integrated Signal Conditioning
- Integrated Passive Elements
- Integrated Active Elements
- Digital Conversion
- A/D Converters
- Performance of A/D Converters
- Implications of A/D Accuracy and Errors
- Using MCUs/DSPs to Increase Sensor IQ
- Other IC Technologies
- Logic Requirements
- MCU Control
- MCUs for Sensor Interface
- Peripherals
- Memory
- Input/Output
- Onboard A/D Conversion
- Power-Saving Capability
- Local Voltage or Current Regulation
- Modular MCU Design
- DSP Control
- Algorithms Versus Lookup Tables
- Techniques and Systems Considerations
- Linearization
- PWM Control
- Autozero and Autorange
- Diagnostics
- Reducing Electromagnetic Compatibility and Radio Frequency Interference
- Indirect (Computed, Not Sensed) Versus Direct Sensing
- Software, Tools, and Support
- Sensor Integration
- Communications for Smart Sensors
- Definitions and Background
- Sources (Organizations) and Standards
- Automotive Protocols
- SAE J1850
- CAN Protocol
- Other Automotive Protocols
- Industrial Networks
- Industrial Usage of CAN
- LonTalk Protocol
- Other Industrial Protocols
- Office/Building Automation
- Home Automation
- CEBus
- LonTalk
- Protocols in Silicon
- MCU With Integrated SAE J1850
- MCU With Integrated CAN
- Neuron Chips and LonTalk Protocol
- MI-Bus
- Other MCUs and Protocols
- Other Aspects of Network Communications
- MCU Protocols
- Transition Between Protocols
- Transition Between Systems
- The Protocol as a Module
- Control Techniques
- Programmable Logic Controllers
- Open- Versus Closed-Loop Systems
- PID Control
- State Machines
- Fuzzy Logic
- Neural Networks
- Combined Fuzzy Logic and Neural Networks
- Adaptive Control
- Observers for Sensing
- Other Control Areas
- RISC Versus CISC
- Combined CISC, RISC, and DSP
- The Impact of Artificial Intelligence
- Transceivers, Transponders, and Telemetry
- The RF Spectrum
- Spread Spectrum
- Wireless Data and Communications
- Wireless Local Area Networks
- FAX/Modems
- Wireless Zone Sensing
- Optical Signal Transmission
- RF Sensing
- Surface Acoustical Wave Devices
- Radar
- Global Positioning System
- Remote Emissions Sensing
- Remote Keyless Entry
- Intelligent Transportation System
- RF-ID
- Other Remote Sensing
- Measuring RF Signal Strength
- Telemetry
- RF MEMS
- MEMS Beyond Sensors
- Micromachined Actuators
- Microvalves
- Micromotors
- Micropumps
- Microdynamometers
- Microsteam Engines
- Actuators in Other Semiconductor Materials
- Other Micromachined Structures
- Cooling Channels
- Microoptics
- Microgrippers
- Microprobes
- Micromirrors
- Heating Elements
- Thermionic Emitters
- Field Emission Displays
- Unfoldable Microelements
- Micronozzles
- Interconnects for Stacked Wafers
- Nanoguitar
- Packaging, Testing, and Reliability Implications of Smarter Sensors
- Semiconductor Packaging Applied to Sensors
- Increased Pin Count
- Hybrid Packaging
- Ceramic Packaging and Ceramic Substrates
- Multichip Modules
- Dual-Chip Packaging
- Ball Grid Array Packaging
- Packaging for Monolithic Sensors
- Plastic Packaging
- Surface-Mount Packaging
- Flip-Chip
- Wafer-Level Packaging
- Reliability Implications
- The Physics of Failure
- Wafer-Level Sensor Reliability
- Testing Smarter Sensors
- Mechatronics and Sensing Systems
- Integration and Mechatronics
- Smart-Power ICs
- Embedded Sensing
- Temperature Sensing
- Current Sensing in Power ICs
- Diagnostics
- MEMS Relays
- Sensing Arrays
- Multiple Sensing Devices
- Multiple Types of Sensors
- An Integrated Sensing System
- Other System Aspects
- Batteries
- Field Emission Displays
- System Voltage Transients, Electrostatic Discharge, and Electromagnetic Interference
- Standards for Smart Sensing
- Setting the Standards for Smart Sensors and Systems
- IEEE 1451.1
- Network-Capable Application Processor
- Network Communication Models
- The IEEE 1451.1 Example
- IEEE 1451.2
- STIM
- Transducer Electronic Data Sheet
- TII
- Calibration/Correction Engine
- Sourcing Power to STIMs
- Representing Physical Units in the TEDS
- IEEE P1451.3
- IEEE P1451.4
- Extending the System to the Network
- The Implications of Smart Sensor Standards
- Sensor Plug-and-Play
- Communicating Sensor Data Via Existing Wiring
- Ethernet
- Sensing by Modem
- Automated/Remote Sensing and the Web
- Wireless Protocol
- Remote Diagnosis
- Process Control Over the Internet
- Alternative Standards
- Airplane Networks
- Automotive Safety Network
- The Next Phase of Sensing Systems
- Future Semiconductor Capabilities
- Future System Requirements
- Not-So-Futuristic Systems
- Fabry-Perot Interferometer
- HVAC Sensor Chip
- Speech Recognition and Micromicrophones
- Electrostatic Mesocooler
- Microangular Rate Sensors
- MCU With Integrated Pressure Sensor
- Wireless Sensing in the Networked Vehicle
- Personal ID Smart Sensor
- Software, Sensing, and the System
- CAD for MEMS
- Alternative Views of Smart Sensing
- The Smart Loop.