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Understanding smart sensors /

Here is a complete, authoritative summary of the latest applications and developments impacting smart sensors in a single volume, now updated to reflect IEEE 1451.2 smart sensor standards. Utilizing the latest in smart sensor, microelectromechanical systems (MEMS) and microelectronic research and de...

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Detalles Bibliográficos
Clasificación:Libro Electrónico
Autor principal: Frank, Randy
Formato: Electrónico eBook
Idioma:Inglés
Publicado: Boston : Artech House, 2000.
Edición:2nd ed.
Colección:Artech House sensors library.
Temas:
Acceso en línea:Texto completo

MARC

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245 1 0 |a Understanding smart sensors /  |c Randy Frank. 
250 |a 2nd ed. 
260 |a Boston :  |b Artech House,  |c 2000. 
300 |a 1 online resource (xxi, 389 pages) :  |b illustrations 
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490 1 |a Artech House sensors library 
504 |a Includes bibliographical references (pages 367-371) and index. 
588 0 |a Print version record. 
505 0 |a Smart Sensor Basics -- Mechanical-Electronic Transitions in Sensing -- Nature of Sensors -- Integration of Micromachining and Microelectronics -- Micromachining -- Bulk Micromachining -- Wafer Bonding -- Silicon-on-Silicon Bonding -- Silicon-on-Glass (Anodic) Bonding -- Silicon Fusion Bonding -- Wafer Bonding for More Complex Structures and Adding ICs -- Surface Micromachining -- Squeeze-Film Damping -- Stiction -- Particulate Control -- Combinations of Surface and Bulk Micromachining -- Other Micromachining Techniques -- LIGA Process -- Dry-Etching Processes -- Micromilling -- Lasers in Micromachining -- Chemical Etching and IC Technology -- Other Micromachined Materials -- Diamond as an Alternative Sensor Material -- Metal Oxides and Piezoelectric Sensing -- Films on Microstructures -- Micromachining Metal Structures -- The Nature of Semiconductor Sensor Output -- Sensor Output Characteristics -- Wheatstone Bridge -- Piezoresistivity in Silicon -- Semiconductor Sensor Definitions -- Static Versus Dynamic Operation -- Other Sensing Technologies -- Capacitive Sensing -- Piezoelectric Sensing -- Hall Effect -- Chemical Sensors -- Improving Sensor Characteristics -- Digital Output Sensors -- Incremental Optical Encoders -- Digital Techniques -- Noise/Interference Aspects -- Low-Power, Low-Voltage Sensors -- Impedance -- Analysis of Sensitivity Improvement -- Thin Diaphragm -- Increased Diaphragm Area -- Combined Solution: Micromachining and Microelectronics -- Getting Sensor Information Into the MCU -- Amplification and Signal Conditioning -- Instrumentation Amplifiers -- SLEEPMODE Operational Amplifier -- Rail-to-Rail Operational Simplifiers -- Switched-Capacitor Amplifier -- Barometer Application Circuit -- 4- to 20-mA Signal Transmitter -- Schmitt Trigger -- Inherent Power-Supply Rejection -- Separate Versus Integrated Signal Conditioning -- Integrated Passive Elements -- Integrated Active Elements -- Digital Conversion -- A/D Converters -- Performance of A/D Converters -- Implications of A/D Accuracy and Errors -- Using MCUs/DSPs to Increase Sensor IQ -- Other IC Technologies -- Logic Requirements -- MCU Control -- MCUs for Sensor Interface -- Peripherals -- Memory -- Input/Output -- Onboard A/D Conversion -- Power-Saving Capability -- Local Voltage or Current Regulation -- Modular MCU Design -- DSP Control -- Algorithms Versus Lookup Tables -- Techniques and Systems Considerations -- Linearization -- PWM Control -- Autozero and Autorange -- Diagnostics -- Reducing Electromagnetic Compatibility and Radio Frequency Interference -- Indirect (Computed, Not Sensed) Versus Direct Sensing -- Software, Tools, and Support -- Sensor Integration -- Communications for Smart Sensors -- Definitions and Background -- Sources (Organizations) and Standards -- Automotive Protocols -- SAE J1850 -- CAN Protocol -- Other Automotive Protocols -- Industrial Networks -- Industrial Usage of CAN -- LonTalk Protocol -- Other Industrial Protocols -- Office/Building Automation -- Home Automation -- CEBus -- LonTalk -- Protocols in Silicon -- MCU With Integrated SAE J1850 -- MCU With Integrated CAN -- Neuron Chips and LonTalk Protocol -- MI-Bus -- Other MCUs and Protocols -- Other Aspects of Network Communications -- MCU Protocols -- Transition Between Protocols -- Transition Between Systems -- The Protocol as a Module -- Control Techniques -- Programmable Logic Controllers -- Open- Versus Closed-Loop Systems -- PID Control -- State Machines -- Fuzzy Logic -- Neural Networks -- Combined Fuzzy Logic and Neural Networks -- Adaptive Control -- Observers for Sensing -- Other Control Areas -- RISC Versus CISC -- Combined CISC, RISC, and DSP -- The Impact of Artificial Intelligence -- Transceivers, Transponders, and Telemetry -- The RF Spectrum -- Spread Spectrum -- Wireless Data and Communications -- Wireless Local Area Networks -- FAX/Modems -- Wireless Zone Sensing -- Optical Signal Transmission -- RF Sensing -- Surface Acoustical Wave Devices -- Radar -- Global Positioning System -- Remote Emissions Sensing -- Remote Keyless Entry -- Intelligent Transportation System -- RF-ID -- Other Remote Sensing -- Measuring RF Signal Strength -- Telemetry -- RF MEMS -- MEMS Beyond Sensors -- Micromachined Actuators -- Microvalves -- Micromotors -- Micropumps -- Microdynamometers -- Microsteam Engines -- Actuators in Other Semiconductor Materials -- Other Micromachined Structures -- Cooling Channels -- Microoptics -- Microgrippers -- Microprobes -- Micromirrors -- Heating Elements -- Thermionic Emitters -- Field Emission Displays -- Unfoldable Microelements -- Micronozzles -- Interconnects for Stacked Wafers -- Nanoguitar -- Packaging, Testing, and Reliability Implications of Smarter Sensors -- Semiconductor Packaging Applied to Sensors -- Increased Pin Count -- Hybrid Packaging -- Ceramic Packaging and Ceramic Substrates -- Multichip Modules -- Dual-Chip Packaging -- Ball Grid Array Packaging -- Packaging for Monolithic Sensors -- Plastic Packaging -- Surface-Mount Packaging -- Flip-Chip -- Wafer-Level Packaging -- Reliability Implications -- The Physics of Failure -- Wafer-Level Sensor Reliability -- Testing Smarter Sensors -- Mechatronics and Sensing Systems -- Integration and Mechatronics -- Smart-Power ICs -- Embedded Sensing -- Temperature Sensing -- Current Sensing in Power ICs -- Diagnostics -- MEMS Relays -- Sensing Arrays -- Multiple Sensing Devices -- Multiple Types of Sensors -- An Integrated Sensing System -- Other System Aspects -- Batteries -- Field Emission Displays -- System Voltage Transients, Electrostatic Discharge, and Electromagnetic Interference -- Standards for Smart Sensing -- Setting the Standards for Smart Sensors and Systems -- IEEE 1451.1 -- Network-Capable Application Processor -- Network Communication Models -- The IEEE 1451.1 Example -- IEEE 1451.2 -- STIM -- Transducer Electronic Data Sheet -- TII -- Calibration/Correction Engine -- Sourcing Power to STIMs -- Representing Physical Units in the TEDS -- IEEE P1451.3 -- IEEE P1451.4 -- Extending the System to the Network -- The Implications of Smart Sensor Standards -- Sensor Plug-and-Play -- Communicating Sensor Data Via Existing Wiring -- Ethernet -- Sensing by Modem -- Automated/Remote Sensing and the Web -- Wireless Protocol -- Remote Diagnosis -- Process Control Over the Internet -- Alternative Standards -- Airplane Networks -- Automotive Safety Network -- The Next Phase of Sensing Systems -- Future Semiconductor Capabilities -- Future System Requirements -- Not-So-Futuristic Systems -- Fabry-Perot Interferometer -- HVAC Sensor Chip -- Speech Recognition and Micromicrophones -- Electrostatic Mesocooler -- Microangular Rate Sensors -- MCU With Integrated Pressure Sensor -- Wireless Sensing in the Networked Vehicle -- Personal ID Smart Sensor -- Software, Sensing, and the System -- CAD for MEMS -- Alternative Views of Smart Sensing -- The Smart Loop. 
520 |a Here is a complete, authoritative summary of the latest applications and developments impacting smart sensors in a single volume, now updated to reflect IEEE 1451.2 smart sensor standards. Utilizing the latest in smart sensor, microelectromechanical systems (MEMS) and microelectronic research and development, you get the technical and practical information you need keep your designs and products on the cutting edge. Plus, you see how advances in fuzzy logic and neural networks continue to determine the direction of smart sensor development. 
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