Materials for high-density electronic packaging and interconnection.
Clasificación: | Libro Electrónico |
---|---|
Autor Corporativo: | National Research Council (U.S.). Committee on Materials for High-Density Electronic Packaging |
Formato: | Electrónico eBook |
Idioma: | Inglés |
Publicado: |
Washington, D.C. :
National Academy Press,
1990.
|
Temas: | |
Acceso en línea: | Texto completo |
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