|
|
|
|
| LEADER |
00000cam a2200000 a 4500 |
| 001 |
EBSCO_ocm44958043 |
| 003 |
OCoLC |
| 005 |
20231017213018.0 |
| 006 |
m o d |
| 007 |
cr cn||||||||| |
| 008 |
000807s1990 dcua ob 000 0 eng d |
| 040 |
|
|
|a N$T
|b eng
|e pn
|c N$T
|d OCL
|d OCLCQ
|d YDXCP
|d OCLCQ
|d NTE
|d OCLCQ
|d OCLCO
|d OCLCQ
|d OCLCF
|d NLGGC
|d OCLCQ
|d SINTU
|d OCLCQ
|d AGLDB
|d OCLCQ
|d VTS
|d INT
|d OCLCQ
|d WYU
|d LVT
|d STF
|d M8D
|d OCLCO
|d OCLCQ
|d OCLCO
|
| 019 |
|
|
|a 733801026
|a 961612242
|a 962704362
|a 1053258813
|
| 020 |
|
|
|a 0585143951
|q (electronic bk.)
|
| 020 |
|
|
|a 9780585143958
|q (electronic bk.)
|
| 020 |
|
|
|a 030904233X
|
| 020 |
|
|
|a 9780309042338
|
| 029 |
1 |
|
|a DEBBG
|b BV043146843
|
| 029 |
1 |
|
|a DEBSZ
|b 422563498
|
| 029 |
1 |
|
|a GBVCP
|b 80059715X
|
| 035 |
|
|
|a (OCoLC)44958043
|z (OCoLC)733801026
|z (OCoLC)961612242
|z (OCoLC)962704362
|z (OCoLC)1053258813
|
| 050 |
|
4 |
|a TK7870
|b .N35 1990eb
|
| 072 |
|
7 |
|a TEC
|x 008070
|2 bisacsh
|
| 072 |
|
7 |
|a TEC
|x 008060
|2 bisacsh
|
| 082 |
0 |
4 |
|a 621.381/046
|2 20
|
| 049 |
|
|
|a UAMI
|
| 110 |
2 |
|
|a National Research Council (U.S.).
|b Committee on Materials for High-Density Electronic Packaging.
|
| 245 |
1 |
0 |
|a Materials for high-density electronic packaging and interconnection.
|
| 260 |
|
|
|a Washington, D.C. :
|b National Academy Press,
|c 1990.
|
| 300 |
|
|
|a 1 online resource (xiv, 139 pages) :
|b illustrations
|
| 336 |
|
|
|a text
|b txt
|2 rdacontent
|
| 337 |
|
|
|a computer
|b c
|2 rdamedia
|
| 338 |
|
|
|a online resource
|b cr
|2 rdacarrier
|
| 500 |
|
|
|a Report of the Committee on Materials for High-Density Electronic Packaging, National Materials Advisory Board, Commission on Engineering and Technical Systems, National Research Council.
|
| 500 |
|
|
|a Available from Defense Technical Information Center, Cameron Station.
|
| 500 |
|
|
|a "NMAB-449."
|
| 504 |
|
|
|a Includes bibliographical references.
|
| 588 |
0 |
|
|a Print version record.
|
| 590 |
|
|
|a eBooks on EBSCOhost
|b EBSCO eBook Subscription Academic Collection - Worldwide
|
| 650 |
|
0 |
|a Electronic packaging
|x Materials.
|
| 650 |
|
6 |
|a Mise sous boîtier (Électronique)
|x Matériaux.
|
| 650 |
|
7 |
|a TECHNOLOGY & ENGINEERING
|x Electronics
|x Microelectronics.
|2 bisacsh
|
| 650 |
|
7 |
|a TECHNOLOGY & ENGINEERING
|x Electronics
|x Digital.
|2 bisacsh
|
| 650 |
|
7 |
|a Electronic packaging
|x Materials
|2 fast
|
| 776 |
0 |
8 |
|i Print version:
|a National Research Council (U.S.). Committee on Materials for High-Density Electronic Packaging.
|t Materials for high-density electronic packaging and interconnection.
|d Washington, D.C. : National Academy Press, 1990
|z 030904233X
|w (DLC) 90060385
|w (OCoLC)21437247
|
| 856 |
4 |
0 |
|u https://ebsco.uam.elogim.com/login.aspx?direct=true&scope=site&db=nlebk&AN=14491
|z Texto completo
|
| 936 |
|
|
|a BATCHLOAD
|
| 938 |
|
|
|a EBSCOhost
|b EBSC
|n 14491
|
| 938 |
|
|
|a YBP Library Services
|b YANK
|n 2309156
|
| 994 |
|
|
|a 92
|b IZTAP
|
