Materials for high-density electronic packaging and interconnection.

Detalles Bibliográficos
Clasificación:Libro Electrónico
Autor Corporativo: National Research Council (U.S.). Committee on Materials for High-Density Electronic Packaging
Formato: Electrónico eBook
Idioma:Inglés
Publicado: Washington, D.C. : National Academy Press, 1990.
Temas:
Electronic packaging > Materials.
Mise sous boîtier (Électronique) > Matériaux.
TECHNOLOGY & ENGINEERING > Electronics > Microelectronics.
TECHNOLOGY & ENGINEERING > Electronics > Digital.
Electronic packaging > Materials
Acceso en línea:Texto completo
Descripción
Notas:Report of the Committee on Materials for High-Density Electronic Packaging, National Materials Advisory Board, Commission on Engineering and Technical Systems, National Research Council.
Available from Defense Technical Information Center, Cameron Station.
"NMAB-449."
Descripción Física:1 online resource (xiv, 139 pages) : illustrations
Bibliografía:Includes bibliographical references.
ISBN:0585143951
9780585143958
030904233X
9780309042338

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