Lumped Elements for RF and Microwave Circuits, Second Edition

Fully updated and including entirely new chapters, this Second Edition provides in-depth coverage of the different types of RF and microwave circuit elements, including inductors, capacitors, resistors, transformers, via holes, airbridges, and crossovers. Featuring extensive formulas for lumped elem...

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Detalles Bibliográficos
Clasificación:Libro Electrónico
Autor principal: Bahl, Inder J.
Formato: Electrónico eBook
Idioma:Inglés
Publicado: Norwood : Artech House, 2022.
Edición:2nd ed.
Temas:
Lumped elements (Electronics)
Constantes localisées (Électronique)
Optoelectronics
Technology & Engineering
Electronic books.
Acceso en línea:Texto completo
Tabla de Contenidos:
  • Lumped Elements for RF and Microwave Circuits Second Edition
  • Contents
  • Preface
  • Chapter 1 Introduction
  • 1.1 History of Lumped Elements
  • 1.2 Why Use Lumped Elements for RF and Microwave Circuits?
  • 1.3 L, C, R Circuit Elements
  • 1.4 Basic Design of Lumped Elements
  • 1.4.1 Capacitor
  • 1.4.2 Inductor
  • 1.4.3 Resistor
  • 1.5 Lumped-Element Modeling
  • 1.6 Fabrication
  • 1.7 Applications
  • References
  • Chapter 2 Inductors
  • 2.1 Introduction
  • 2.2 Basic Definitions
  • 2.2.1 Inductance
  • 2.2.2 Magnetic Energy
  • 2.2.3 Mutual Inductance
  • 2.2.4 Effective Inductance
  • 2.2.5 Impedance
  • 2.2.6 Time Constant
  • 2.2.7 Quality Factor
  • 2.2.8 Self-Resonant Frequency
  • 2.2.9 Maximum Current Rating
  • 2.2.10 Maximum Power Rating
  • 2.2.11 Other Parameters
  • 2.3 Inductor Configurations
  • 2.4 Inductor Models
  • 2.4.1 Analytical Models
  • 2.4.2 Coupled-Line Approach
  • 2.4.3 Mutual Inductance Approach
  • 2.4.4 Numerical Approach
  • 2.4.5 Measurement-Based Model
  • 2.5 Coupling Between Inductors
  • 2.5.1 Low-Resistivity Substrates
  • 2.5.2 High-Resistivity Substrates
  • 2.6 Electrical Representations
  • 2.6.1 Series and Parallel Representations
  • 2.6.2 Network Representations
  • References
  • Chapter 3 Printed Inductors
  • 3.1 Inductors on Si Substrate
  • 3.1.1 Conductor Loss
  • 3.1.2 Substrate Loss
  • 3.1.3 Layout Considerations
  • 3.1.4 Inductor Model
  • 3.1.5 Q-Enhancement Techniques
  • 3.1.6 Stacked-Coil Inductor
  • 3.1.7 Temperature Dependence
  • 3.2 Inductors on GaAs Substrate
  • 3.2.1 Inductor Models
  • 3.2.2 Figure of Merit
  • 3.2.3 Comprehensive Inductor Data
  • 3.2.4 Q-Enhancement Techniques
  • 3.2.5 Compact Inductors
  • 3.2.6 High Current Handling Capability Inductors
  • 3.3 Printed Circuit Board Inductors
  • 3.4 Hybrid Integrated Circuit Inductors
  • 3.4.1 Thin-Film Inductors
  • 3.4.2 Thick-Film Inductors
  • 3.4.3 LTCC Inductors
  • 3.5 Ferromagnetic Inductors
  • References
  • Chapter 4 Wire Inductors
  • 4.1 Wire-Wound Inductors
  • 4.1.1 Analytical Expressions
  • 4.1.2 Compact High-Frequency Inductors
  • 4.2 Bond Wire Inductor
  • 4.2.1 Single and Multiple Wires
  • 4.2.2 Wire Near a Corner
  • 4.2.3 Wire on a Substrate Backed by a Ground Plane
  • 4.2.4 Wire Above a Substrate Backed by a Ground Plane
  • 4.2.5 Curved Wire Connecting Substrates
  • 4.2.6 Twisted Wire
  • 4.2.7 Maximum Current Handling of Wires
  • 4.3 Wire Models
  • 4.3.1 Numerical Methods for Bond Wires
  • 4.3.2 Measurement-Based Model for Air Core Inductors
  • 4.3.3 Measurement-Based Model for Bond Wires
  • 4.4 Broadband Inductors
  • 4.5 Magnetic Materials
  • References
  • Chapter 5 Capacitors
  • 5.1 Introduction
  • 5.2 Capacitor Parameters
  • 5.2.1 Capacitor Value
  • 5.2.2 Effective Capacitance
  • 5.2.3 Tolerances
  • 5.2.4 Temperature Coefficient
  • 5.2.5 Quality Factor
  • 5.2.6 Equivalent Series Resistance
  • 5.2.7 Series and Parallel Resonances
  • 5.2.8 Dissipation Factor or Loss Tangent

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