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Lumped Elements for RF and Microwave Circuits, Second Edition

Fully updated and including entirely new chapters, this Second Edition provides in-depth coverage of the different types of RF and microwave circuit elements, including inductors, capacitors, resistors, transformers, via holes, airbridges, and crossovers. Featuring extensive formulas for lumped elem...

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Detalles Bibliográficos
Clasificación:Libro Electrónico
Autor principal: Bahl, Inder J.
Formato: Electrónico eBook
Idioma:Inglés
Publicado: Norwood : Artech House, 2022.
Edición:2nd ed.
Temas:
Acceso en línea:Texto completo

MARC

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100 1 |a Bahl, Inder J. 
245 1 0 |a Lumped Elements for RF and Microwave Circuits, Second Edition  |h [electronic resource]. 
250 |a 2nd ed. 
260 |a Norwood :  |b Artech House,  |c 2022. 
300 |a 1 online resource (593 p.) 
336 |a text  |b txt  |2 rdacontent 
337 |a computer  |b c  |2 rdamedia 
338 |a online resource  |b cr  |2 rdacarrier 
500 |a Description based upon print version of record. 
505 0 |a Lumped Elements for RF and Microwave Circuits Second Edition -- Contents -- Preface -- Chapter 1 Introduction -- 1.1 History of Lumped Elements -- 1.2 Why Use Lumped Elements for RF and Microwave Circuits? -- 1.3 L, C, R Circuit Elements -- 1.4 Basic Design of Lumped Elements -- 1.4.1 Capacitor -- 1.4.2 Inductor -- 1.4.3 Resistor -- 1.5 Lumped-Element Modeling -- 1.6 Fabrication -- 1.7 Applications -- References -- Chapter 2 Inductors -- 2.1 Introduction -- 2.2 Basic Definitions -- 2.2.1 Inductance -- 2.2.2 Magnetic Energy -- 2.2.3 Mutual Inductance -- 2.2.4 Effective Inductance 
505 8 |a 2.2.5 Impedance -- 2.2.6 Time Constant -- 2.2.7 Quality Factor -- 2.2.8 Self-Resonant Frequency -- 2.2.9 Maximum Current Rating -- 2.2.10 Maximum Power Rating -- 2.2.11 Other Parameters -- 2.3 Inductor Configurations -- 2.4 Inductor Models -- 2.4.1 Analytical Models -- 2.4.2 Coupled-Line Approach -- 2.4.3 Mutual Inductance Approach -- 2.4.4 Numerical Approach -- 2.4.5 Measurement-Based Model -- 2.5 Coupling Between Inductors -- 2.5.1 Low-Resistivity Substrates -- 2.5.2 High-Resistivity Substrates -- 2.6 Electrical Representations -- 2.6.1 Series and Parallel Representations 
505 8 |a 2.6.2 Network Representations -- References -- Chapter 3 Printed Inductors -- 3.1 Inductors on Si Substrate -- 3.1.1 Conductor Loss -- 3.1.2 Substrate Loss -- 3.1.3 Layout Considerations -- 3.1.4 Inductor Model -- 3.1.5 Q-Enhancement Techniques -- 3.1.6 Stacked-Coil Inductor -- 3.1.7 Temperature Dependence -- 3.2 Inductors on GaAs Substrate -- 3.2.1 Inductor Models -- 3.2.2 Figure of Merit -- 3.2.3 Comprehensive Inductor Data -- 3.2.4 Q-Enhancement Techniques -- 3.2.5 Compact Inductors -- 3.2.6 High Current Handling Capability Inductors -- 3.3 Printed Circuit Board Inductors 
505 8 |a 3.4 Hybrid Integrated Circuit Inductors -- 3.4.1 Thin-Film Inductors -- 3.4.2 Thick-Film Inductors -- 3.4.3 LTCC Inductors -- 3.5 Ferromagnetic Inductors -- References -- Chapter 4 Wire Inductors -- 4.1 Wire-Wound Inductors -- 4.1.1 Analytical Expressions -- 4.1.2 Compact High-Frequency Inductors -- 4.2 Bond Wire Inductor -- 4.2.1 Single and Multiple Wires -- 4.2.2 Wire Near a Corner -- 4.2.3 Wire on a Substrate Backed by a Ground Plane -- 4.2.4 Wire Above a Substrate Backed by a Ground Plane -- 4.2.5 Curved Wire Connecting Substrates -- 4.2.6 Twisted Wire 
505 8 |a 4.2.7 Maximum Current Handling of Wires -- 4.3 Wire Models -- 4.3.1 Numerical Methods for Bond Wires -- 4.3.2 Measurement-Based Model for Air Core Inductors -- 4.3.3 Measurement-Based Model for Bond Wires -- 4.4 Broadband Inductors -- 4.5 Magnetic Materials -- References -- Chapter 5 Capacitors -- 5.1 Introduction -- 5.2 Capacitor Parameters -- 5.2.1 Capacitor Value -- 5.2.2 Effective Capacitance -- 5.2.3 Tolerances -- 5.2.4 Temperature Coefficient -- 5.2.5 Quality Factor -- 5.2.6 Equivalent Series Resistance -- 5.2.7 Series and Parallel Resonances -- 5.2.8 Dissipation Factor or Loss Tangent 
500 |a 5.2.9 Time Constant 
520 8 |a Fully updated and including entirely new chapters, this Second Edition provides in-depth coverage of the different types of RF and microwave circuit elements, including inductors, capacitors, resistors, transformers, via holes, airbridges, and crossovers. Featuring extensive formulas for lumped elements, design trade-offs, and an updated and current list of references, the book helps you understand the value and usefulness of lumped elements in the design of RF, microwave and millimeter wave components and circuits. You'll find a balanced treatment between standalone lumped elements and their circuits using MICs, MMICs and RFICs technologies. You'll also find detailed information on a broader range RFICs that was not available when the popular first edition was published. The book captures - in one consolidated volume -- the fundamentals, equations, modeling, examples, references and overall procedures to design, test and produce microwave components that are indispensable in industry and academia today. With its superb organization and expanded coverage of the subject, this is a must-have, go-to resource for practicing engineers and researchers in industry, government and university and microwave engineers working in the antenna area. Students will also find it a useful reference with its clear explanations, many examples and practical modeling guidelines. 
590 |a ProQuest Ebook Central  |b Ebook Central Academic Complete 
650 0 |a Lumped elements (Electronics) 
650 6 |a Constantes localisées (Électronique) 
653 |a Optoelectronics 
653 |a Technology & Engineering 
655 0 |a Electronic books. 
776 0 8 |i Print version:  |a Bahl, Inder J.  |t Lumped Elements for RF and Microwave Circuits, Second Edition  |d Norwood : Artech House,c2022  |z 9781630819323 
856 4 0 |u https://ebookcentral.uam.elogim.com/lib/uam-ebooks/detail.action?docID=30339942  |z Texto completo 
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