Integrated circuits, photodiodes and organic field effect transistors /
Clasificación: | Libro Electrónico |
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Otros Autores: | , |
Formato: | Electrónico eBook |
Idioma: | Inglés |
Publicado: |
New York :
Nova Science Publishers,
[2009]
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Colección: | Environmental research advances series.
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Temas: | |
Acceso en línea: | Texto completo |
Tabla de Contenidos:
- ""INTEGRATED CIRCUITS,PHOTODIODES AND ORGANIC FIELDEFFECT TRANSISTORS""; ""CONTENTS""; ""PREFACE""; ""RESEARCH AND REVIEW STUDIES""; ""METAMATERIALS TECHNOLOGY: APPLICATIONTO RADIOFREQUENCY AND MICROWAVE CIRCUITS""; ""ABSTRACT""; ""1. INTRODUCTION TO METAMATERIALS""; ""2. METAMATERIALS IN PLANAR TECHNOLOGY:METAMATERIAL TRANSMISSION LINES""; ""2.1. The Dual Transmission Line Concept""; ""2.2. CL-Loaded Lines: The Composite Right/Left Handed TransmissionLine Concept""; ""2.3. Resonant Type Metamaterial Transmission Lines""; ""3. APPLICATIONS OF METAMATERIAL TRANSMISSION LINES""
- ""3.1. Metamaterial Filters""""3.1.1. Stop Band Filters: Application to Spurious Suppression in ConventionalFilters""; ""3.1.2. Narrow Band Pass Filters and Diplexers""; ""3.1.3. Wide and Ultra Wide Band (UWB) Pass Filters""; ""3.1.4. Metamaterial Based Filters Subjected to Standard Responses:A Design Methodology""; ""3.2. Enhanced Bandwidth Components""; ""3.3. Multiband Components""; ""4. CONCLUSION""; ""REFERENCES""; ""RELIABILITY ASSESSMENT OF INTEGRATEDCIRCUITS AND ITS MISCONCEPTION""; ""ABSTRACT""; ""I. THE IMPORTANCE OF INTEGRATED CIRCUIT RELIABILITY""
- ""II. COMMON RELIABILITY PRACTICES IN INTEGRATEDCIRCUIT INDUSTRY""""1. Process Reliability Test in Wafer Fabrication Manufacturers""; ""2. Product Reliability Tests in IC Assembly and Packaging Manufacturers""; ""3. Highly Accelerated Stress Test (HAST)""; ""III. MISCONCEPTIONS IN COMMON RELIABILITY ASSESSMENTOF INTEGRATED CIRCUITS""; ""1. Zero Failure Represents Good Reliability""; ""2. Higher MTTF Represents Better Reliability""; ""3. MTTF Is the Mean Failure Time""; ""4. Exponential Distribution Is Sufficient to Analyze the Test Data""
- ""5. The Higher the Stress, the More Effective Is the Reliability Test""""A. Masked Failure Mechanism""; ""B. Variation of Failure Mechanism""; ""6. All Test Data Are Valid""; ""7. Only One Failure Mechanism Exist in the Failed Units""; ""8. Probability Plot Is Sufficient for Test Data Analysis""; ""9. Small Sample Size Is Sufficient""; ""10. The Important of Confidence Interval""; ""IV. CONCLUSION""; ""REFERENCES""; ""DESIGN OF A MULTICHANNEL INTEGRATEDBIOSENSOR CHIP AND MICROELECTRONIC SYSTEMFOR EXTRACELLULAR NEURAL RECORDING""; ""ABSTRACT""; ""1. INTRODUCTION""; ""2. SYSTEM OVERVIEW""
- ""3. SYSTEM ARCHITECTURE AND DESIGN""""3.1. Neural Signal Input""; ""3.2. Preamplifier Buffers""; ""3.3. Analysis and Design of the Two-Stage Amplifier BasedPreamplifier Buffer""; ""3.3.1. Device Model""; ""3.3.2. Frequency Response and Pole/Zero Locations""; ""3.3.3. Output Swing""; ""3.3.4. Common-Mode Input Range""; ""3.3.5. Internal Slew Rate""; ""3.3.6. External Slew Rate""; ""3.3.7. Systematic Input-Referred Offset Voltage Minimization""; ""3.3.8. Input-Referred Thermal Noise""; ""3.3.9. Preamplifier Buffer Design""; ""3.4. Channels Addressing and Sequencing""