Lead-free soldering process development and reliability

Detalles Bibliográficos
Clasificación:Libro Electrónico
Autor principal: BATH
Formato: Electrónico eBook
Idioma:Inglés
Publicado: [Place of publication not identified], JOHN WILEY & Sons, 2019.
Colección:Quality and Reliability Engineering Ser.
Temas:
Electronic packaging.
Solder and soldering.
Mise sous boîtier (Électronique)
Soudure.
solder.
Electronic packaging
Solder and soldering
Acceso en línea:Texto completo
Tabla de Contenidos:
  • Cover
  • Title Page
  • Copyright
  • Contents
  • List of Contributors
  • Introduction
  • Chapter 1 Lead-Free Surface Mount Technology
  • 1.1 Introduction
  • 1.2 Lead-Free Solder Paste Alloys
  • 1.3 Solder Paste Printing
  • 1.3.1 Introduction
  • 1.3.2 Key Paste Printing Elements
  • 1.4 Component Placement
  • 1.4.1 Introduction
  • 1.4.2 Key Placement Parameters
  • 1.4.2.1 Nozzle
  • 1.4.2.2 Vision System
  • 1.4.2.3 PCB Support
  • 1.4.2.4 Component Size, Packaging, and Feeder Capacity
  • 1.4.2.5 Feeder Capacity
  • 1.5 Reflow Process
  • 1.5.1 Introduction
  • 1.5.2 Key Parameters
  • 1.5.2.1 Preheat
  • 1.5.2.2 Soak
  • 1.5.2.3 Reflow
  • 1.5.2.4 Cooling
  • 1.5.2.5 Reflow Atmosphere
  • 1.6 Vacuum Soldering
  • 1.7 Paste in Hole
  • 1.8 Robotic Soldering
  • 1.9 Advanced Technologies
  • 1.9.1 Flip Chip
  • 1.9.2 Package on Package
  • 1.10 Inspection
  • 1.10.1 Solder Paste Inspection (SPI)
  • 1.10.2 Solder Joint Inspection
  • 1.10.2.1 Automated Optical Inspection (AOI)
  • 1.10.2.2 X-ray Inspection
  • 1.11 Conclusions
  • References
  • Chapter 2 Wave/Selective Soldering
  • 2.1 Introduction
  • 2.2 Flux
  • 2.2.1 The Function of a Flux
  • 2.2.2 Flux Contents
  • 2.3 Amount of Flux Application on a Board
  • 2.4 Flux Handling
  • 2.5 Flux Application
  • 2.5.1 Methods to Apply Flux (Wave Soldering)
  • 2.5.2 Methods to Apply Flux (Selective Soldering)
  • 2.6 Preheat
  • 2.6.1 Preheat Process-Heating Methods
  • 2.6.2 Preheat Temperatures
  • 2.6.3 Preheat Time
  • 2.6.4 Controlling Preheat Temperatures
  • 2.6.5 Board Warpage Compensation (Selective Soldering)
  • 2.7 Selective Soldering
  • 2.7.1 Different Selective Soldering Point to Point Nozzles (Selective Soldering)
  • 2.7.2 Solder Temperatures (Selective Soldering)
  • 2.7.3 Dip/Contact Times (Selective Soldering)
  • 2.7.4 Drag Conditions (Selective Soldering)
  • 2.7.5 Nitrogen Environment (Selective Soldering)
  • 2.7.6 Wave Height Controls (Selective Soldering)
  • 2.7.7 De-Bridging Tools (Selective Soldering)
  • 2.7.8 Solder Pot (Selective Soldering)
  • 2.7.9 Topside Heating during Soldering (Selective Soldering)
  • 2.7.10 Selective Soldering Dip Process with Nozzle Plates (Selective Soldering)
  • 2.7.11 Solder Temperatures for Multi-Wave Dip Soldering (Selective Soldering)
  • 2.7.12 Nitrogen Environment (Selective Soldering)
  • 2.7.13 Wave Height Control (Selective Soldering)
  • 2.7.14 Dip Time - Contact Time with Solder (Selective Soldering)
  • 2.7.15 Solder Flow Acceleration and Deceleration (Selective Soldering)
  • 2.7.16 De-Bridging Tools (Selective Soldering)
  • 2.7.17 Pallets (Selective Soldering)
  • 2.7.18 Conveyor (Selective Soldering)
  • 2.8 Wave Soldering
  • 2.8.1 Wave Formers (Wave Soldering)
  • 2.8.2 Pallets (Wave Soldering)
  • 2.8.3 Nitrogen Environment (Wave Soldering)
  • 2.8.4 Process Control (Wave Soldering)
  • 2.8.5 Conveyor (Wave Soldering)
  • 2.9 Conclusions
  • References
  • Chapter 3 Lead-Free Rework
  • 3.1 Introduction

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