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00000cam a2200000M 4500 |
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EBOOKCENTRAL_on1158706195 |
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OCoLC |
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20240329122006.0 |
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m o d |
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cr |n||||||||| |
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200621s2019 xx o 000 0 eng d |
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|a YDX
|b eng
|c YDX
|d EBLCP
|d REDDC
|d OCLCF
|d OCLCQ
|d OCLCO
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| 019 |
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|a 1159169475
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| 020 |
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|a 9781119482048
|q (electronic bk.)
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| 020 |
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|a 1119482046
|q (electronic bk.)
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| 020 |
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|z 1119482038
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| 020 |
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|z 9781119482031
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| 035 |
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|a (OCoLC)1158706195
|z (OCoLC)1159169475
|
| 050 |
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4 |
|a TK7870.15
|b .L433 2020
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| 082 |
0 |
4 |
|a 621.381/046
|2 23
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| 049 |
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|a UAMI
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| 100 |
1 |
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|a BATH.
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| 245 |
1 |
0 |
|a Lead-free soldering process development and reliability
|h [electronic resource].
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| 260 |
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|a [Place of publication not identified],
|b JOHN WILEY & Sons,
|c 2019.
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| 300 |
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|a 1 online resource
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| 490 |
1 |
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|a Quality and Reliability Engineering Ser.
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| 505 |
0 |
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|a Cover -- Title Page -- Copyright -- Contents -- List of Contributors -- Introduction -- Chapter 1 Lead-Free Surface Mount Technology -- 1.1 Introduction -- 1.2 Lead-Free Solder Paste Alloys -- 1.3 Solder Paste Printing -- 1.3.1 Introduction -- 1.3.2 Key Paste Printing Elements -- 1.4 Component Placement -- 1.4.1 Introduction -- 1.4.2 Key Placement Parameters -- 1.4.2.1 Nozzle -- 1.4.2.2 Vision System -- 1.4.2.3 PCB Support -- 1.4.2.4 Component Size, Packaging, and Feeder Capacity -- 1.4.2.5 Feeder Capacity -- 1.5 Reflow Process -- 1.5.1 Introduction -- 1.5.2 Key Parameters -- 1.5.2.1 Preheat
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| 505 |
8 |
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|a 1.5.2.2 Soak -- 1.5.2.3 Reflow -- 1.5.2.4 Cooling -- 1.5.2.5 Reflow Atmosphere -- 1.6 Vacuum Soldering -- 1.7 Paste in Hole -- 1.8 Robotic Soldering -- 1.9 Advanced Technologies -- 1.9.1 Flip Chip -- 1.9.2 Package on Package -- 1.10 Inspection -- 1.10.1 Solder Paste Inspection (SPI) -- 1.10.2 Solder Joint Inspection -- 1.10.2.1 Automated Optical Inspection (AOI) -- 1.10.2.2 X-ray Inspection -- 1.11 Conclusions -- References -- Chapter 2 Wave/Selective Soldering -- 2.1 Introduction -- 2.2 Flux -- 2.2.1 The Function of a Flux -- 2.2.2 Flux Contents -- 2.3 Amount of Flux Application on a Board
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| 505 |
8 |
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|a 2.4 Flux Handling -- 2.5 Flux Application -- 2.5.1 Methods to Apply Flux (Wave Soldering) -- 2.5.2 Methods to Apply Flux (Selective Soldering) -- 2.6 Preheat -- 2.6.1 Preheat Process-Heating Methods -- 2.6.2 Preheat Temperatures -- 2.6.3 Preheat Time -- 2.6.4 Controlling Preheat Temperatures -- 2.6.5 Board Warpage Compensation (Selective Soldering) -- 2.7 Selective Soldering -- 2.7.1 Different Selective Soldering Point to Point Nozzles (Selective Soldering) -- 2.7.2 Solder Temperatures (Selective Soldering) -- 2.7.3 Dip/Contact Times (Selective Soldering)
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| 505 |
8 |
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|a 2.7.4 Drag Conditions (Selective Soldering) -- 2.7.5 Nitrogen Environment (Selective Soldering) -- 2.7.6 Wave Height Controls (Selective Soldering) -- 2.7.7 De-Bridging Tools (Selective Soldering) -- 2.7.8 Solder Pot (Selective Soldering) -- 2.7.9 Topside Heating during Soldering (Selective Soldering) -- 2.7.10 Selective Soldering Dip Process with Nozzle Plates (Selective Soldering) -- 2.7.11 Solder Temperatures for Multi-Wave Dip Soldering (Selective Soldering) -- 2.7.12 Nitrogen Environment (Selective Soldering) -- 2.7.13 Wave Height Control (Selective Soldering)
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| 505 |
8 |
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|a 2.7.14 Dip Time - Contact Time with Solder (Selective Soldering) -- 2.7.15 Solder Flow Acceleration and Deceleration (Selective Soldering) -- 2.7.16 De-Bridging Tools (Selective Soldering) -- 2.7.17 Pallets (Selective Soldering) -- 2.7.18 Conveyor (Selective Soldering) -- 2.8 Wave Soldering -- 2.8.1 Wave Formers (Wave Soldering) -- 2.8.2 Pallets (Wave Soldering) -- 2.8.3 Nitrogen Environment (Wave Soldering) -- 2.8.4 Process Control (Wave Soldering) -- 2.8.5 Conveyor (Wave Soldering) -- 2.9 Conclusions -- References -- Chapter 3 Lead-Free Rework -- 3.1 Introduction
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| 590 |
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|a ProQuest Ebook Central
|b Ebook Central Academic Complete
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| 650 |
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0 |
|a Electronic packaging.
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| 650 |
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0 |
|a Solder and soldering.
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| 650 |
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6 |
|a Mise sous boîtier (Électronique)
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| 650 |
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6 |
|a Soudure.
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| 650 |
|
7 |
|a solder.
|2 aat
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| 650 |
|
7 |
|a Electronic packaging
|2 fast
|
| 650 |
|
7 |
|a Solder and soldering
|2 fast
|
| 776 |
0 |
8 |
|c Original
|z 1119482038
|z 9781119482031
|w (OCoLC)1031448900
|
| 830 |
|
0 |
|a Quality and Reliability Engineering Ser.
|
| 856 |
4 |
0 |
|u https://ebookcentral.uam.elogim.com/lib/uam-ebooks/detail.action?docID=6229588
|z Texto completo
|
| 938 |
|
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|a YBP Library Services
|b YANK
|n 301337473
|
| 938 |
|
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|a ProQuest Ebook Central
|b EBLB
|n EBL6229588
|
| 994 |
|
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|a 92
|b IZTAP
|
