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Imaps 2018
| Clasificación: | Libro Electrónico |
|---|---|
| Autor principal: | |
| Otros Autores: | |
| Formato: | Electrónico eBook |
| Idioma: | Inglés |
| Publicado: |
Bradford, West Yorkshire :
Emerald Publishing Limited,
2019.
|
| Colección: | Circuit World Ser.
|
| Temas: | |
| Acceso en línea: | Texto completo |
Tabla de Contenidos:
- Cover; Guest editorial; Joints realized by sintering of pressureless Ag paste; Photonic curing of silver paths on 3D printed polymer substrate; Investigation of inkjet printed path resistance in the context of manufacture and flexible application; Electrical and rheological percolation threshold of graphene pastes for screen-printing; Piezoresistive effect in embedded thick-film resistors; Advances on high current load effects on lead-free solder joints of SMD chip-size components and BGAs; Signal integrity in microelectronic hybrid systems made on metal substrates