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|a UAMI
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|a Pecht, Michael.
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|a Imaps 2018
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|a Bradford, West Yorkshire :
|b Emerald Publishing Limited,
|c 2019.
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|a Cover; Guest editorial; Joints realized by sintering of pressureless Ag paste; Photonic curing of silver paths on 3D printed polymer substrate; Investigation of inkjet printed path resistance in the context of manufacture and flexible application; Electrical and rheological percolation threshold of graphene pastes for screen-printing; Piezoresistive effect in embedded thick-film resistors; Advances on high current load effects on lead-free solder joints of SMD chip-size components and BGAs; Signal integrity in microelectronic hybrid systems made on metal substrates
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|a Pecht, Michael.
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|d Bradford, West Yorkshire : Emerald Publishing Limited, ©2019
|z 9781838676674
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