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Nanoimprinting and Its Applications
| Clasificación: | Libro Electrónico |
|---|---|
| Autor principal: | |
| Formato: | Electrónico eBook |
| Idioma: | Inglés |
| Publicado: |
Milton :
Pan Stanford Publishing,
2019.
|
| Temas: | |
| Acceso en línea: | Texto completo |
Tabla de Contenidos:
- Cover; Half Title; Title Page; Copyright Page; Contents; Preface; 1. Introduction; 1.1 Background; 1.2 Principle of Nanoimprinting; 1.3 Applications; 2. Template Technology; 2.1 Template Fabrication; 2.1.1 Photolithography; 2.1.2 Self-Organization by a Block Copolymer; 2.1.3 Self-Organization by Anodic Oxidation; 2.1.4 Interference Exposure; 2.2 Release Process; 2.2.1 Release Layer; 2.2.2 Degradation of the Release Layer; 2.2.3 Recovery of the Release Layer; 3. Thermal Nanoimprinting; 3.1 Process; 3.2 Resin Materials; 3.3 Molds; 3.4 Equipment
- 3.5 Example of Thermal Nanoimprinting: Sheet Nanoimprinting3.5.1 Experimental; 3.5.2 Results and Analysis; 4. Photonanoimprinting; 4.1 Process; 4.2 Materials; 4.2.1 UV-Curable Resin; 4.2.2 Coupling Treatment; 4.3 Molds; 4.3.1 Glass Mold; 4.3.2 Soft Mold; 4.4 Equipment; 4.4.1 Parallel Press; 4.4.2 Roll Press; 4.5 Example of Photonanoimprinting; 4.5.1 Process Sequence; 4.5.2 Soft Mold; 4.5.3 Coupling Treatment Process; 4.5.4 Dry Etching of Aluminum; Appendix A: Fidelity of a Soft Mold; Appendix B: Resin Viscosity in Nanospace; Appendix C: Restriction of Air Bubbles
- 5. Room-Temperature Nanoimprinting5.1 Introduction; 5.2 RT-NILUsing a PDMS Mold; 5.2.1 Patterning; 5.2.2 Three-Dimensional Nanostructure Fabrication; 5.3 Example of NIL; 5.3.1 Moth Eye Structure Fabrication; 5.3.2 Gold Nanoparticle Formation Using an Imprinted HSQ Pattern for SERS; 5.4 Conclusions; 6. Basic Mechanisms of Nanoimprint Lithography; 6.1 Introduction; 6.2 Basic Process Mechanisms; 6.3 Result and Discussion; 6.3.1 Impact of the Applied Pressure; 6.3.2 Impact of the Aspect Ratio; 6.3.3 Impact of the Initial Resin Thickness; 6.4 Defect Analysis and Process Optimization
- 6.4.1 Typical Defect in High-Aspect-Ratio Pattern Fabrication6.4.2 Simulation and Experiments; 6.4.2.1 Step 1: Pressing and holding; 6.4.2.2 Step 2: Cooling; 6.4.2.3 Step 3: Releasing; 6.4.3 Optimization of the Process Sequence; 6.4.4 High-Aspect-Ratio Pattern Fabrication; 6.5 Time-Dependent Analysis; 6.5.1 Numerical Models; 6.5.2 Experimental Study; 6.5.3 Result and Discussion; 6.6 Summary; 7. UV Nanoimprint Lithography Process Simulation; 7.1 Introduction; 7.2 Resist-Filling Process; 7.2.1 Numerical Model; 7.2.2 Resist Droplet Process under Air Ambient
- 7.2.3 Resist Spin-Coating Process under Condensable Gas Ambient7.3 UV Exposure Process; 7.3.1 Numerical Model; 7.3.2 Simulation Models and Demonstrations; 7.3.2.1 Impact of feature size; 7.3.2.2 Impact of optical index; 7.4 UV Curing Process; 7.4.1 Numerical Model; 7.5 Experimental Results; 7.5.1 Photoinitiator Concentration during UV Exposure; 7.5.2 Monomer Conversion; 7.5.3 Elastic Modulus; 7.6 Summary; 8. Demolding Process Simulation; 8.1 Introduction; 8.2 Numerical Model; 8.2.1 Numerical Model; 8.2.2 Parameter Extraction by Experiment; 8.3 Demolding Mechanism; 8.4 Result and Discussion