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Nanoimprinting and Its Applications

Detalles Bibliográficos
Clasificación:Libro Electrónico
Autor principal: Miyauchi, Akihiro
Formato: Electrónico eBook
Idioma:Inglés
Publicado: Milton : Pan Stanford Publishing, 2019.
Temas:
Acceso en línea:Texto completo

MARC

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245 1 0 |a Nanoimprinting and Its Applications 
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336 |a text  |b txt  |2 rdacontent 
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588 0 |a Print version record. 
505 0 |a Cover; Half Title; Title Page; Copyright Page; Contents; Preface; 1. Introduction; 1.1 Background; 1.2 Principle of Nanoimprinting; 1.3 Applications; 2. Template Technology; 2.1 Template Fabrication; 2.1.1 Photolithography; 2.1.2 Self-Organization by a Block Copolymer; 2.1.3 Self-Organization by Anodic Oxidation; 2.1.4 Interference Exposure; 2.2 Release Process; 2.2.1 Release Layer; 2.2.2 Degradation of the Release Layer; 2.2.3 Recovery of the Release Layer; 3. Thermal Nanoimprinting; 3.1 Process; 3.2 Resin Materials; 3.3 Molds; 3.4 Equipment 
505 8 |a 3.5 Example of Thermal Nanoimprinting: Sheet Nanoimprinting3.5.1 Experimental; 3.5.2 Results and Analysis; 4. Photonanoimprinting; 4.1 Process; 4.2 Materials; 4.2.1 UV-Curable Resin; 4.2.2 Coupling Treatment; 4.3 Molds; 4.3.1 Glass Mold; 4.3.2 Soft Mold; 4.4 Equipment; 4.4.1 Parallel Press; 4.4.2 Roll Press; 4.5 Example of Photonanoimprinting; 4.5.1 Process Sequence; 4.5.2 Soft Mold; 4.5.3 Coupling Treatment Process; 4.5.4 Dry Etching of Aluminum; Appendix A: Fidelity of a Soft Mold; Appendix B: Resin Viscosity in Nanospace; Appendix C: Restriction of Air Bubbles 
505 8 |a 5. Room-Temperature Nanoimprinting5.1 Introduction; 5.2 RT-NILUsing a PDMS Mold; 5.2.1 Patterning; 5.2.2 Three-Dimensional Nanostructure Fabrication; 5.3 Example of NIL; 5.3.1 Moth Eye Structure Fabrication; 5.3.2 Gold Nanoparticle Formation Using an Imprinted HSQ Pattern for SERS; 5.4 Conclusions; 6. Basic Mechanisms of Nanoimprint Lithography; 6.1 Introduction; 6.2 Basic Process Mechanisms; 6.3 Result and Discussion; 6.3.1 Impact of the Applied Pressure; 6.3.2 Impact of the Aspect Ratio; 6.3.3 Impact of the Initial Resin Thickness; 6.4 Defect Analysis and Process Optimization 
505 8 |a 6.4.1 Typical Defect in High-Aspect-Ratio Pattern Fabrication6.4.2 Simulation and Experiments; 6.4.2.1 Step 1: Pressing and holding; 6.4.2.2 Step 2: Cooling; 6.4.2.3 Step 3: Releasing; 6.4.3 Optimization of the Process Sequence; 6.4.4 High-Aspect-Ratio Pattern Fabrication; 6.5 Time-Dependent Analysis; 6.5.1 Numerical Models; 6.5.2 Experimental Study; 6.5.3 Result and Discussion; 6.6 Summary; 7. UV Nanoimprint Lithography Process Simulation; 7.1 Introduction; 7.2 Resist-Filling Process; 7.2.1 Numerical Model; 7.2.2 Resist Droplet Process under Air Ambient 
505 8 |a 7.2.3 Resist Spin-Coating Process under Condensable Gas Ambient7.3 UV Exposure Process; 7.3.1 Numerical Model; 7.3.2 Simulation Models and Demonstrations; 7.3.2.1 Impact of feature size; 7.3.2.2 Impact of optical index; 7.4 UV Curing Process; 7.4.1 Numerical Model; 7.5 Experimental Results; 7.5.1 Photoinitiator Concentration during UV Exposure; 7.5.2 Monomer Conversion; 7.5.3 Elastic Modulus; 7.6 Summary; 8. Demolding Process Simulation; 8.1 Introduction; 8.2 Numerical Model; 8.2.1 Numerical Model; 8.2.2 Parameter Extraction by Experiment; 8.3 Demolding Mechanism; 8.4 Result and Discussion 
500 |a 8.4.1 Impact on the Critical Stresses P[sub(s)] and P[sub(n)] 
590 |a ProQuest Ebook Central  |b Ebook Central Academic Complete 
650 0 |a Nanolithography. 
650 6 |a Nanolithographie. 
650 7 |a Nanolithography  |2 fast 
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856 4 0 |u https://ebookcentral.uam.elogim.com/lib/uam-ebooks/detail.action?docID=5789239  |z Texto completo 
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994 |a 92  |b IZTAP