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Adhesives for wood and lignocellulosic materials /

"The book is a comprehensive treatment of the subject covering a wide range of subjects uniquely available in a single source for the first time. A material science approach has been adopted in dealing with wood adhesion and adhesives. The approach of the authors was to bring out hierarchical c...

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Detalles Bibliográficos
Clasificación:Libro Electrónico
Autores principales: Kumar, Ramamurtinanda (Autor), Pizzi, A. (Antonio), 1946- (Autor)
Formato: Electrónico eBook
Idioma:Inglés
Publicado: Hoboken, NJ : Salem, MA : John Wiley & Sons, Inc. ; Scrivener Publishing LLC, 2019.
Edición:First edition.
Temas:
Acceso en línea:Texto completo
Tabla de Contenidos:
  • Intro; Title Page; Copyright; Dedication; Preface; References; Part A: Substrates, Adhesives, and Adhesion; Chapter 1: Wood as a Unique Adherend; 1.1 Introduction; 1.2 Wood, An Adherend with Hierarchical Structure; 1.3 Details of Structural Hierarchy in Wood; 1.4 Chemical Composition; 1.5 Influence of Hierarchical Structure of Wood on Wood-Adhesive Interaction; 1.6 Effect of Hierarchical Structure of Wood on Adhesive Penetration; 1.7 Wood Factors Affecting Penetration; 1.8 Influence of Resin Type and Formulation on Penetration; 1.9 Effect of Processing Parameters on Penetration; References
  • Chapter 2: Fundamentals of Adhesion2.1 Introduction; 2.2 Definitions; 2.3 Mechanism of Adhesion; 2.4 Theories of Adhesion; 2.5 Electronic Theory; 2.6 Diffusion Theory; 2.7 Adsorption/Covalent Bond Theory; 2.8 Adhesion Interactions as a Function of Length Scale; 2.9 Wetting of the Substrate by the Adhesive; 2.10 Equilibrium Contact Angle; 2.11 Thermodynamic Work of Adhesion; 2.12 Spreading Coefficient; 2.13 Zisman's Rectilinear Relationship-Zisman's Plots and Critical Surface Tension of a Solid; 2.14 Effect of Surface Roughness on Contact Angle; 2.15 Weak Boundary Layer Theory
  • 2.16 Measurement of the Wetting Parameters for Wood Substrate2.17 Covalent Bond Formation; References; Chapter 3: Urea-Formaldehyde Resins; 3.1 Introduction; 3.2 Historical Review of UF Resins (Plastic Historical Society) [3]; 3.3 Reaction between Urea and Formaldehyde; 3.4 Reaction Sequence; 3.5 Manufacture of UF Resin; 3.6 Chemistry of Reaction-Conventional Process (Alkaline-Acid Process/Three-Step Process); 3.7 Composition of the Commercial UF Resins; 3.8 Reactions of UF during Storage; 3.9 Reaction Parameters in the Production of Amino Resins (General)
  • 3.10 Four-Step Process for Low Formaldehyde Emission3.11 Curing of UF Resins; 3.12 Cross-Linked Structure; 3.13 Triazinone for Curing the UF Resin; 3.14 Distinguishing Feature of UF from other Synthetic Resin Adhesives such as MUF and PF; 3.15 Other Curing Agents; 3.16 Protic Ionic Liquids as a New Hardener-Modifier System; 3.17 Improvement of Water Resistance and Adhesive Performance of UF Resin [71]; 3.18 Characterization of UF Resin; 3.19 UF Resin Cure Kinetics; 3.20 UF Resins with Low Formaldehyde Emission; 3.21 Modification by Polyamines; 3.22 Cyclic Urea Prepolymer
  • 3.23 Improvement of UF and MUF Resins by Addition of Hyperbranched DendrimersReferences; Chapter 4: Melamine-Formaldehyde Resin; 4.1 Introduction; 4.2 Chemistry; 4.3 Melamine-Urea-Formaldehyde (MUF) Resin; References; Chapter 5: Phenol-Formaldehyde Resins; 5.1 Introduction; 5.2 Historical; 5.3 Definitions and Types of Phenolic Resins; 5.4 Basic Chemistry; 5.5 Effect of Process Variables; 5.6 Commercial Phenolic Resin for Wood Products; 5.7 Curing of Phenolic Resin; References; Chapter 6: Resorcinol-Formaldehyde Resins and Hydroxymethyl Resorcinol (HMR and n-HMR); 6.1 Introduction