Low Power Circuit Design Using Advanced CMOS Technology /

Mostrar otras versiones (2)

Offers a summary of lectures from the first Advanced CMOS Technology Summer School (ACTS) 2017. The slides are selected from the handouts, while the text was edited according to the lecturers talk.

Detalles Bibliográficos
Clasificación:Libro Electrónico
Otros Autores: Zhang, Milin (Editor ), Wang, Zhihua (Editor ), Van der Spiegel, Jan (Editor ), Maloberti, F. (Franco) (Editor )
Formato: Electrónico eBook
Idioma:Inglés
Publicado: Aalborg, Denmark : River Publishers, [2018]
Colección:Tutorials in circuits and systems.
Temas:
Electronic circuits.
Semiconductors > Technological innovations.
Circuits électroniques.
Semi-conducteurs > Innovations.
TECHNOLOGY & ENGINEERING > Mechanical.
Electronic circuits
Electronic books.
Acceso en línea:Texto completo
Texto completo
Tabla de Contenidos:
  • Front Cover; Tiltle Page
  • Low Power Circuit Design Using Advanced CMOS Technology; Series Page
  • Tutorials in Circuits and Systems; Copyright Page; Table of contents; Introduction; Chapter 01
  • Semiconductor Innovation
  • a Continuum of Opportunities; THE CHANGING WORLD; 1 Smaller Number of Players for Leading Edge Nodes; 2 Theme of this Talk; 3 Recent Acquisitions of Start-up Companies; 4 Changes Occurring at an Amazing Rate! (I); 5 Changes Occurring at an Amazing Rate! (II); 6 Semiconductors Drive the Electronics Food Chain ... ; INDUSTRY BACKGROUND AND CHALLENGES
  • 7 The Electronics System Industry8 Technology Scaling Basics; 9 Some Definitions; 10 Nanometers (nm) ... a Matter of Scale; 11 1970 Intel 4004 ... 2.3 K Transistors Today ...>2B Transistors; 12 We have come a LONG way! ... yet a LONG Way to go!; 13 Economics of Moore's Law; 14 Moore's Scaling ... is it at the limit?; 15 Voltage Scaling Evolution; 16 Previous Predictions of the End; 17 Moore Scaling ... many TECHNICAL challenges; 18 Rising Design Cost and Complexity; 19 Economic Challenges are Threatening; 20 Cost Reduction thru Technology Scaling
  • 21 Intel's Approach to Tech Scaling and Feature Enhancements22 Die Cost Reduction thru Defect Reduction/Yield Improvement; 23 Cost Reduction thru Wafer Diameter Increase; 24 Cost per Transistor has been Reduced Consistently; 25 Cost per Transistor Reduction by Wafer Size and Node; 26 "More than Moore" Activities; MARKET DRIVERS; 27 Mobile Wireless Evolution; 28 The "Internet of Things"; 29 "The future is already here ... "; 30 The Internet of Everything is growing fast; 31 Increasing Adoption of Technology in lives around the world; 32 The Internet is significantly challenged
  • 33 Automotive Semiconductor content increasing34 Electronics Value Chain ... Auto Nav System; 35 Multi-Tiers of Value Chain and Ecosystems; 36 Markets and Opportunities are exploding!; OPPORTUNITIES; 37 Many Smartphone Features; 38 Smartphones
  • Looking Inside; 39 MANY Levels of Innovation; 40 Leading Technology Advances from IMEC ... July 2017; 41 Product Innovation Through Early Co-Design; 42 HTC Desire Smartphone uses Qualcomm's MSM 8255; 43 An example; 44 Applying SoC technologies in "Adjacent" Markets; 45 Qualcomm
  • moving to Integrated Platforms
  • 46 Intelligence everywhere ... needs many technical solutions -47 Enabling the Secure Connected Car of Tomorrow; 48 Today's Wearables; 49 New Techniques; 50 The Internet of Things (IoT); 51 The Skyworks View ... 51; 52 Expand Focus on holistic SOLUTIONS; 53 Technology Transitions driven by Power & Innovations; 54 A history of Design & Technology Innovations; 55 Beyond CMOS Computing; 56 Enhanced capabilities but more complex processes; 57 Semiconductor Industry "Pillars"; 58 Vertically Integrated IDM approach now practiced at fewer companies; 59 Electronics Value Chain ... Smartphones

Ejemplares similares