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Microwave power amplifier design with MMIC modules /
Solid state power amplifiers (SSPA) are a critical part of many microwave systems. Designing SSPAs with monolithic microwave integrated circuits (MMIC) has boosted device performance to much higher levels focused on PA modules. This cutting-edge book offers engineers practical guidance in selecting...
| Clasificación: | Libro Electrónico |
|---|---|
| Autor principal: | |
| Formato: | Electrónico eBook |
| Idioma: | Inglés |
| Publicado: |
Norwood, MA :
Artech House,
[2018]
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| Colección: | Artech House microwave library.
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| Temas: | |
| Acceso en línea: | Texto completo |
Tabla de Contenidos:
- Intro; Microwave Power Amplifier Design with MMIC Modules; Contents; Preface; Introduction; Part I: Useful Microwave Design Concepts; Part II: Designing the Power Amplifier; Part III: Designing the Power Amplifier System; Summary; Chapter 1 Introduction; 1.1 Introduction to Designing Microwave Solid State Power Amplifiers; 1.2 Applications of SSPAs; 1.3 A Typical SSPA Configuration; 1.4 Typical Documents Starting a Project; 1.5 General Format of the SCD; 1.5.1 Paragraph 1.0: Scope; 1.5.2 Paragraph 2.0: Applicable Documents; 1.5.3 Paragraph 3.0: Requirements; 1.5.4 Paragraph 4.0: Verification.
- 1.5.5 Paragraph 5.0: Packaging1.5.6 Paragraph 6.0: Notes; 1.6 Requirements Section of an SCD; 1.6.1 Electrical Requirements; 1.6.2 Mechanical Requirements; 1.6.3 Environmental Requirements; 1.6.4 Other Design Criteria; References; Part I Useful Microwave Design Concepts; Chapter 2 Lumped Components in RF and Microwave Circuitry; 2.1 Applicability of Lumped Element Analysis; 2.1.1 Calculating Wavelengths; 2.1.2 Example: Calculating Wavelengths for Lumped Circuit Analysis; 2.2 Capacitor Characteristics at High Frequencies; 2.2.1 Single-Layer and Multilayer Capacitor Construction.
- 2.2.2 High-Frequency Capacitor Models2.2.3 Capacitor Losses (Q); 2.2.4 Capacitor Resonance; 2.3 Resistor Characteristics at High Frequencies; 2.3.1 High-Frequency Surface Mount Resistors; 2.3.2 Flip-Chip Surface Mount Resistors; 2.3.3 Thick-Film and Thin-Film Surface-Mount Resistors; 2.3.4 High-Frequency Effects of Thick-Film and Thin-Film Resistors; 2.3.5 Notes on Thin-Film Resistors; 2.3.6 Notes on Thick-Film Resistors; 2.4 Inductors; 2.4.1 Calculating Inductance of a Cylindrical Coil of Wire; 2.4.2 Inductors at High Frequencies; 2.4.3 Inductors at Resonance.
- 2.4.4 Inductance of a Straight Wire2.4.5 Planar Spiral Inductors; 2.4.6 Conical Inductors; 2.4.7 Inductance of Via Holes; 2.4.8 Inductance of Bond Wire; 2.4.9 Inductance of Flat or Ribbon Wire; References; Chapter 3 Transmission Lines; 3.1 Introduction to Transmission Line Theory; 3.2 Common Transmission Line Topologies; 3.3 Transmission Line Characteristics Using Lumped Circuit Elements; 3.3.1 Distributed Lumped Constant Model; 3.3.2 Modeling a Microstrip Transmission Line with Distributed Lumped Elements; 3.3.3 Characteristic Impedance of Transmission Line from the Lumped Circuit Model.