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Mechanics of Microsystems.

Mechanics of Microsystems Alberto Corigliano, Raffaele Ardito, Claudia Comi, Attilio Frangi, Aldo Ghisi and Stefano Mariani, Politecnico di Milano, Italy A mechanical approach to microsystems, covering fundamental concepts including MEMS design, modelling and reliability Mechanics of Microsystems ta...

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Detalles Bibliográficos
Clasificación:	Libro Electrónico
Autor principal:	Corigliano, Alberto
Otros Autores:	Ardito, Raffaele, Comi, Claudia, Frangi, Attilio, Ghisi, Aldo, Mariani, Stefano
Formato:	Electrónico eBook
Idioma:	Inglés
Publicado:	Newark : John Wiley & Sons, Incorporated, 2017.
Colección:	Microsystem and Nanotechnology Series (ME20) Ser.
Temas:	Microelectromechanical systems. Micro-Electrical-Mechanical Systems Microsystèmes électromécaniques. TECHNOLOGY & ENGINEERING > Mechanical. Microelectromechanical systems
Acceso en línea:	Texto completo

Tabla de Contenidos:

Cover
Title Page
Copyright
Dedication
Contents
Series Preface
Preface
Acknowledgements
Notation
About the Companion Website
Chapter 1 Introduction
1.1 Microsystems
1.2 Microsystems Fabrication
1.3 Mechanics in Microsystems
1.4 Book Contents
References
Part I Fundamentals
Chapter 2 Fundamentals of Mechanics and Coupled Problems
2.1 Introduction
2.2 Kinematics and Dynamics of Material Points and Rigid Bodies
2.2.1 Basic Notions of Kinematics and Motion Composition
2.2.1.1 Summary
2.2.2 Basic Notions of Dynamics and Relative Dynamics
2.2.2.1 Summary
2.2.3 One‐Degree‐of‐Freedom Oscillator
2.2.3.1 Summary
2.2.4 Rigid‐Body Kinematics and Dynamics
2.2.4.1 Rigid‐Body Kinematics
2.2.4.2 Rigid‐Body Dynamics
2.2.4.3 Summary
2.3 Solid Mechanics
2.3.1 Linear Elastic Problem for Deformable Solids
2.3.1.1 Linear Elastic Cubic Material
2.3.1.2 Linear Elastic Transversely Isotropic Material
2.3.1.3 Linear Elastic Orthotropic Material
2.3.1.4 Summary
2.3.2 Linear Elastic Problem for Beams
2.3.2.1 Examples
2.3.2.2 Summary
2.4 Fluid Mechanics
2.4.1 Navier-Stokes Equations
2.4.1.1 Newtonian Fluids
2.4.1.2 Incompressible Fluids
2.4.1.3 Perfect Fluids
2.4.1.4 Stokes Flow
2.4.1.5 Initial and Boundary Conditions
2.4.1.6 Summary
2.4.2 Fluid-Structure Interaction
2.5 Electrostatics and Electromechanics
2.5.1 Basic Notions of Electrostatics
2.5.1.1 Examples
2.5.1.2 Summary
2.5.2 Simple Electromechanical Problem
2.5.2.1 Static Equilibrium
2.5.2.2 Dynamic Response
2.5.2.3 Summary
2.5.3 General Electromechanical Coupled Problem
2.5.3.1 Summary
2.6 Piezoelectric Materials in Microsystems
2.6.1 Piezoelectric Materials
2.6.2 Piezoelectric Modelling
2.6.2.1 Summary.
2.7 Heat Conduction and Thermomechanics
2.7.1 Heat Problem
2.7.1.1 Example: Unidimensional Thermal Problem
2.7.1.2 Summary
2.7.2 Thermomechanical Coupled Problem
2.7.2.1 Summary
References
Chapter 3 Modelling of Linear and Nonlinear Mechanical Response
3.1 Introduction
3.2 Fundamental Principles
3.2.1 Principle of Virtual Power
3.2.2 Total Potential Energy Principle
3.2.3 Hamilton's Principle
3.2.4 Specialization of the Principle of Virtual Powers to Beams
3.3 Approximation Techniques and Weighted Residuals Approach
3.4 Exact and Approximate Solutions for Dynamic Problems
3.4.1 Free Flexural Linear Vibrations of a Single‐span Beam
3.4.2 Nonlinear Vibration of an Axially Loaded Beam
3.5 Example of Application: Bistable Elements
References
Part II Devices
Chapter 4 Accelerometers
4.1 Introduction
4.2 Capacitive Accelerometers
4.2.1 In‐Plane Sensing
4.2.2 Out‐of‐Plane Sensing
4.3 Resonant Accelerometers
4.3.1 Resonating Proof Mass
4.3.2 Resonating Elements Coupled to the Proof Mass
4.4 Examples
4.4.1 Three‐Axis Capacitive Accelerometer
4.4.2 Out‐of‐Plane Resonant Accelerometer
4.4.3 In‐Plane Resonant Accelerometer
4.5 Design Problems and Reliability Issues
References
Chapter 5 Coriolis‐Based Gyroscopes
5.1 Introduction
5.2 Basic Working Principle
5.2.1 Sensitivity of Coriolis Vibratory Gyroscopes
5.3 Lumped‐Mass Gyroscopes
5.3.1 Symmetric and Decoupled Gyroscope
5.3.2 Tuning‐Fork Gyroscope
5.3.3 Three‐Axis Gyroscope
5.3.4 Gyroscopes with Resonant Sensing
5.4 Disc and Ring Gyroscopes
5.5 Design Problems and Reliability Issues
References
Chapter 6 Resonators
6.1 Introduction
6.2 Electrostatically Actuated Resonators
6.3 Piezoelectric Resonators
6.4 Nonlinearity Issues
References.
Chapter 7 Micromirrors and Parametric Resonance
7.1 Introduction
7.2 Electrostatic Resonant Micromirror
7.2.1 Numerical Simulations with a Continuation Approach
7.2.1.1 Computation of the Electrostatic Torque and its Derivative via Direct Finite Element Method
7.2.2 Experimental Set‐Up
7.2.2.1 Sinusoidal Excitation
7.2.2.2 Square Wave Excitation
References
Chapter 8 Vibrating Lorentz Force Magnetometers
8.1 Introduction
8.2 Vibrating Lorentz Force Magnetometers
8.2.1 Classical Devices
8.2.2 Improved Design
8.2.3 Further Improvements
8.3 Topology or Geometry Optimization
References
Chapter 9 Mechanical Energy Harvesters
9.1 Introduction
9.2 Inertial Energy Harvesters
9.2.1 Classification of Resonant Energy Harvesters
9.2.2 Mechanical Model of a Simple Piezoelectric Harvester
9.2.2.1 Piezoelectric Constitutive Law for Beams
9.2.2.2 The Principle of Virtual Power for a Piezoelectric Cantilever Beam
9.2.2.3 Governing Equations via the Weighted Residuals Approach
9.2.2.4 Solution in the Frequency Domain
9.3 Frequency Upconversion and Bistability
9.4 Fluid-Structure Interaction Energy Harvesters
9.4.1 Synopsis of Aeroelastic Phenomena
9.4.1.1 Vortex‐Induced Vibration
9.4.1.2 Flutter Instability
9.4.2 Energy Harvesting through Vortex‐Induced Vibration
9.4.3 Energy Harvesting through Flutter Instability
References
Chapter 10 Micropumps
10.1 Introduction
10.2 Modelling Issues for Diaphragm Micropumps
10.3 Modelling of Electrostatic Actuator
10.3.1 Simplified Electromechanical Model
10.3.1.1 The Principle of Virtual Work for an Axisymmetric Plate
10.3.1.2 Electrostatic Forces
10.3.1.3 Governing Equations via the Weighted Residuals Approach
10.3.2 Reliability Issues
10.3.2.1 Electrostatic Pull‐In
10.3.2.2 Adhesion.
10.3.2.3 Actuator Control
10.4 Multiphysics Model of an Electrostatic Micropump
10.5 Piezoelectric Micropumps
10.5.1 Modelling of the Actuator
10.5.2 Complete Multiphysics Model
References
Part III Reliability and Dissipative Phenomena
Chapter 11 Mechanical Characterization at the Microscale
11.1 Introduction
11.2 Mechanical Characterization of Polysilicon as a Structural Material for Microsystems
11.2.1 Polysilicon as a Structural Material for Microsystems
11.2.2 Testing Methodologies
11.2.3 Quasi‐Static Testing
11.2.3.1 Off‐Chip Tension Test
11.2.3.2 Off‐Chip and On‐Chip Bending Test
11.2.3.3 Test on Membranes (Bulge Test)
11.2.3.4 Nanoindenter‐Driven Test
11.2.4 High‐Frequency Testing
11.2.4.1 Fatigue Mechanisms
11.3 Weibull Approach
11.4 On‐Chip Testing Methodology for Experimental Determination of Elastic Stiffness and Nominal Strength
11.4.1 On‐Chip Bending Test through a Comb‐Finger Rotational Electrostatic Actuator
11.4.1.1 General Description
11.4.1.2 Data Reduction Procedure
11.4.1.3 Experimental Results
11.4.2 On‐Chip Bending Test through a Parallel‐Plate Electrostatic Actuator
11.4.2.1 General Description
11.4.2.2 Data Reduction Procedure
11.4.2.3 Experimental Results
11.4.3 On‐Chip Tensile Test through an Electrothermomechanical Actuator
11.4.3.1 General Description
11.4.3.2 Data Reduction Procedure
11.4.3.3 Experimental Results
11.4.4 On‐Chip Test for Thick Polysilicon Films
11.4.4.1 General Description
11.4.4.2 Data Reduction Procedure
11.4.4.3 Experimental Results
References
Chapter 12 Fracture and Fatigue in Microsystems
12.1 Introduction
12.2 Fracture Mechanics: An Overview
12.3 MEMS Failure Modes due to Cracking
12.3.1 Cracking and Delamination at Package Level
12.3.2 Cracking at Silicon Film Level.
12.4 Fatigue in Microsystems
12.4.1 An Introduction to Fatigue in Mechanics
12.4.2 Polysilicon Fatigue
12.4.3 Fatigue in Metals at the Microscale
12.4.4 Fatigue Testing at the Microscale
References
Chapter 13 Accidental Drop Impact
13.1 Introduction
13.2 Single‐Degree‐of‐Freedom Response to Drops
13.3 Estimation of the Acceleration Peak Induced by an Accidental Drop
13.4 A Multiscale Approach to Drop Impact Events
13.4.1 Macroscale Level
13.4.2 Mesoscale Level
13.4.3 Microscale Level
13.5 Results: Drop‐Induced Failure of Inertial MEMS
References
Chapter 14 Fabrication‐Induced Residual Stresses and Relevant Failures
14.1 Main Sources of Residual Stresses in Microsystems
14.2 The Stoney Formula and its Modifications
14.3 Experimental Methods for the Evaluation of Residual Stresses
14.4 Delamination, Buckling and Cracks in Thin Films due to Residual Stresses
References
Chapter 15 Damping in Microsystems
15.1 Introduction
15.2 Gas Damping in the Continuum Regime with Slip Boundary Conditions
15.2.1 Experimental Validation at Ambient Pressure
15.2.2 Effects of Decreasing Working Pressure
15.3 Gas Damping in the Rarefied Regime
15.3.1 Evaluation of Damping at Low Pressure using Kinetic Models
15.3.2 Linearization of the BGK Model
15.3.3 Numerical Implementation
15.3.4 Application to MEMS
15.4 Gas Damping in the Free‐Molecule Regime
15.4.1 Boundary Integral Equation Approach
15.4.2 Experimental Validations
15.5 Solid Damping: Thermoelasticity
15.6 Solid Damping: Anchor Losses
15.6.1 Analytical Estimation of Dissipation
15.6.1.1 Applications: Axial and Bending Modes
15.6.2 Numerical Estimation of Anchor Losses
15.7 Solid Damping: Additional unknown Sources
Surface Losses
15.7.1 Solid Damping: Deviations from Thermoelasticity.

Mechanics of Microsystems.

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