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SiP-System in Package Design and Simulation : Mentor EE Flow Advanced Design Guide.

An advanced reference documenting, in detail, every step of a real System-in-Package (SiP) design flow, this extensively illustrated book is an indispensable working resource for every SiP designer, especially those who use Mentor design tools. --

Detalles Bibliográficos
Clasificación:Libro Electrónico
Autor principal: Li, Suny, 1974-
Formato: Electrónico eBook
Idioma:Inglés
Publicado: Newark : John Wiley & Sons, Incorporated, 2017.
Temas:
Acceso en línea:Texto completo

MARC

LEADER 00000cam a2200000Mi 4500
001 EBOOKCENTRAL_ocn994710127
003 OCoLC
005 20240329122006.0
006 m o d
007 cr |n|---|||||
008 170729s2017 nju ob 001 0 eng d
040 |a EBLCP  |b eng  |e pn  |c EBLCP  |d YDX  |d IDEBK  |d OCLCQ  |d COO  |d DEBBG  |d OCLCQ  |d OCLCO  |d Z$K  |d LGG  |d OCLCQ  |d UKMGB  |d OCLCQ  |d UAB  |d K6U  |d OCLCF  |d D6H  |d S9I  |d EYM  |d OCLCO  |d OCLCQ  |d OCLCO  |d OCLCL 
015 |a GBB7C4106  |2 bnb 
016 7 |a 018430940  |2 Uk 
019 |a 1000152613  |a 1021819429  |a 1237222747 
020 |a 9781119046011 
020 |a 1119046017 
020 |a 9781119045991  |q (electronic book) 
020 |a 1119045991  |q (electronic book) 
020 |z 9781119046004 
020 |z 1119046009 
020 |z 9781119045939  |q (hardcover) 
020 |z 1119045932 
029 1 |a AU@  |b 000062393257 
029 1 |a UKMGB  |b 018430940 
035 |a (OCoLC)994710127  |z (OCoLC)1000152613  |z (OCoLC)1021819429  |z (OCoLC)1237222747 
037 |a 9781119046004  |b Wiley 
050 4 |a TK7874  |b .L437 2017 
072 7 |a TEC  |x 009070  |2 bisacsh 
082 0 4 |a 621.3815  |2 23 
049 |a UAMI 
100 1 |a Li, Suny,  |d 1974-  |1 https://id.oclc.org/worldcat/entity/E39PCjwV4RkgkWmqXhWFkfgVG3 
245 1 0 |a SiP-System in Package Design and Simulation :  |b Mentor EE Flow Advanced Design Guide. 
260 |a Newark :  |b John Wiley & Sons, Incorporated,  |c 2017. 
300 |a 1 online resource (506 pages) 
336 |a text  |b txt  |2 rdacontent 
337 |a computer  |b c  |2 rdamedia 
338 |a online resource  |b cr  |2 rdacarrier 
347 |a data file  |2 rda 
588 0 |a Print version record. 
505 0 |a Cover; Title Page; Copyright; Contents; About the Author; Preface; Chapter 1 SiP Design and Simulation Platform; 1.1 From package to SiP; 1.2 The development of mentor SiP design technology; 1.3 The mentor SiP design and simulation platform; 1.3.1 SiP platform introduction; 1.3.2 Schematic input; 1.3.3 Concurrent system design; 1.3.4 SiP board design; 1.3.5 Signal integrity and power integrity simulation; 1.3.6 Thermal analysis; 1.3.7 The advantages of the mentor SiP design and simulation platform; 1.3.7.1 Characteristics of mentor SiP design and simulation platform. 
505 8 |a 1.3.7.2 Design areas of mentor SiP design and simulation platform1.4 The introduction of the finished project; Chapter 2 Introduction to Package; 2.1 Definition and function of package; 2.2 Development of packaging technology; 2.3 SiP and Related Technologies; 2.3.1 The appearance of SiP technology; 2.3.2 SoC and SiP; 2.3.3 SiP-related technologies; 2.4 The development of the package market; 2.5 Package manufacturers; 2.5.1 Traditional package manufacturers; 2.5.2 New SiP manufacturers in different areas; 2.6 Bare chip suppliers; Chapter 3 The SiP Production Process. 
505 8 |a 3.1 BGA: The mainstream SiP package form3.2 The SiP package production process; 3.3 Three key elements of SiP; Chapter 4 New Package Technologies; 4.1 TSV (Through Silicon Via) technology; 4.1.1 TSV introduction; 4.1.2 TSV technical characteristics; 4.1.3 TSV application and prospects; 4.2 Integrated passive device (IPD) technology; 4.2.1 IPD introduction; 4.2.2 The advantages of IPD; 4.3 Package on package (PoP) technology; 4.3.1 The limitations of 3D SiP; 4.3.2 The application of PoP; 4.3.3 The emphasis in PoP design; 4.4 Apple A8 processor -- an example of a PoP product. 
505 8 |a Chapter 5 SiP Design and Simulation Flow5.1 SiP design and simulation flow; 5.2 Design and simulation process in Mentor EE Flow; 5.2.1 Library creation; 5.2.2 Schematic design; 5.2.3 Layout design; 5.2.4 Design simulation; Chapter 6 Central Library; 6.1 The structure of the central library; 6.2 Introduction to the Dashboard; 6.3 Schematic symbol creation; 6.4 Bare chip cell creation; 6.4.1 Create bare chip padstack; 6.4.2 Create bare chip cell; 6.5 BGA cell creation; 6.5.1 Create BGA padstack; 6.5.2 Create BGA cell manually; 6.5.2.1 Tips for renaming the pin numbers. 
505 8 |a 6.5.2.2 View layers defined in padstacks6.5.3 Create BGA cell with Die Wizard; 6.5.4 LP Wizard professional library tool; 6.6 Part creation; 6.7 Create cell via part; Chapter 7 Schematic Input; 7.1 Netlist input; 7.2 Basic schematic input; 7.2.1 Start DxDesigner; 7.2.1.1 General toolbar; 7.2.1.2 Digital/analog simulation toolbar; 7.2.1.3 RF circuit design toolbar; 7.2.2 Create new project; 7.2.2.1 How to create a new project; 7.2.2.2 Net connection and draw toolbar; 7.2.3 Schematic design check; 7.2.4 Design rules setup; 7.2.5 Package design; 7.2.5.1 Packaging options. 
500 |a 7.2.5.2 PDB Extraction Options. 
520 |a An advanced reference documenting, in detail, every step of a real System-in-Package (SiP) design flow, this extensively illustrated book is an indispensable working resource for every SiP designer, especially those who use Mentor design tools. --  |c Edited summary from book. 
504 |a Includes bibliographical references and index. 
590 |a ProQuest Ebook Central  |b Ebook Central Academic Complete 
650 0 |a Integrated circuits  |x Design and construction. 
650 0 |a Multichip modules (Microelectronics)  |x Design and construction. 
650 6 |a Circuits intégrés  |x Conception et construction. 
650 7 |a TECHNOLOGY & ENGINEERING  |x Mechanical.  |2 bisacsh 
650 7 |a Integrated circuits  |x Design and construction  |2 fast 
650 7 |a Multichip modules (Microelectronics)  |x Design and construction  |2 fast 
758 |i has work:  |a SiP-system in package design and simulation (Text)  |1 https://id.oclc.org/worldcat/entity/E39PCFyWB7QBB94pWW86fYmgjy  |4 https://id.oclc.org/worldcat/ontology/hasWork 
776 0 8 |i Print version:  |a (Li Yang), Suny Li.  |t SiP-System in Package Design and Simulation : Mentor EE Flow Advanced Design Guide.  |d Newark : John Wiley & Sons, Incorporated, ©2017  |z 9781119045939 
856 4 0 |u https://ebookcentral.uam.elogim.com/lib/uam-ebooks/detail.action?docID=4915580  |z Texto completo 
938 |a ProQuest Ebook Central  |b EBLB  |n EBL4915580 
938 |a ProQuest MyiLibrary Digital eBook Collection  |b IDEB  |n cis37767496 
938 |a YBP Library Services  |b YANK  |n 14696530 
938 |a YBP Library Services  |b YANK  |n 14708811 
994 |a 92  |b IZTAP