Cargando…
Microwave Material Applications.
| Clasificación: | Libro Electrónico |
|---|---|
| Autor principal: | |
| Formato: | Electrónico eBook |
| Idioma: | Inglés |
| Publicado: |
Norwood :
Artech House,
2016.
|
| Colección: | Artech House microwave library.
|
| Temas: | |
| Acceso en línea: | Texto completo |
Tabla de Contenidos:
- Microwave Material Applications: Device Miniaturization and Integration; Contents; Preface; Introduction; Acknowledgments; 1 New Magnetic Materials; 1.1 New High Magnetization Garnets for Microwave Magnetic Devices; 1.2 The Structure of Garnets; 1.3 The Magnetization and Curie Temperature of Bismuth-Substituted YIG; 1.4 Dielectric Constant and Bismuth Content; 1.5 Octahedral Substitution; 1.6 Comparison with Existing YIG-Based Materials; 1.7 Device Considerations; References; Selected Bibliography ; 2 New Magnetic Materials: Expanding Applications.
- 2.1 Higher-Frequency Devices Using New Low-Magnetization Garnets2.2 Choice of Substitute Elements; 2.3 Nonmagnetic Tetrahedral Substitution; 2.4 Vanadium Substitution; 2.5 Aluminum Substitution; 2.6 Gadolinium Substitution ; 2.7 Comparison with Existing Materials; References; 3 Miniaturization of Ferrite Devices Using High Dielectric Constant Ferrite; 3.1 Description of the Junction Circulator Mode; 3.2 Experimental Proof of Size Reduction; 3.3 Device Implications of Dielectric Constant; 3.4 Miniaturization of Other Ferrite Devices.
- 3.5 High Dielectric Constant Garnet and Latching and Switching Devices3.6 Low-Frequency Antennas; References; Selected Bibliography; 4 Dielectrics; 4.1 Background; 4.2 High Dielectric Constant Materials; 4.3 Perovskites; 4.4 Tetragonal Tungsten Bronze Dielectrics (TTBs); 4.5 Bismuth Niobium-Based Systems; 4.6 Summary of Candidate Dielectrics; 4.7 Low Dielectric Constant Materials (LTCC); 4.8 LTCC Integration; 4.9 Low Dielectric Constant MICs; 4.10 Low Dielectric Constant Soft-Substrate Hybrid Assembly; References; 5 Further Miniaturization with Combinations of Bismuth Garnets and Dielectrics.
- 5.1 Introduction5.2 Above-Resonance Operation; 5.3 Below-Resonance Operation; 5.4 Microstrip Devices; References; Selected Bibliography; 6 Absorbers; 6.1 Introduction; 6.2 Low-Permittivity, Magnetic/Dielectric Composite Absorbers; 6.3 Ferroelectric Absorbers Based on BaTiO3; 6.4 Combinations of Ferroelectric and Magnetic Absorbers; 6.5 Commercial Absorbers as Loads; 6.6 New Materials Based on Magnetic Metal Combinations; 6.7 Ferrite-Based Absorbers; 6.8 Hexagonal Ferrites as Absorbers; 6.9 Ferrite Polymer Composites as Absorbers; 6.10 Alternate Ferroelectric Absorbers.
- 6.11 Low-Temperature Firing Absorbers6.12 Very High-Power Absorbers; References; Selected Bibliography; 7 Dielectric and Magnetic Integration; 7.1 First Steps in Integration and Their Effect on Microwave Performance; 7.2 Nonmagnetic Garnets as Dielectric Substrates; 7.3 Combinations of Garnets; 7.4 Performance Enhancement: Insertion Loss and Intermodulation; 7.5 Other Sources of Insertion Loss in Magnetic Devices; 7.6 Intermodulation (IMD); 7.7 Below-Resonance IMD Reduction; 7.8 IMD in Dielectrics; 7.9 IMD and Harmonics in Systems; References; 8 Antennas; 8.1 Antenna Application Trends.