|
|
|
|
| LEADER |
00000cam a2200000Mu 4500 |
| 001 |
EBOOKCENTRAL_ocn986371103 |
| 003 |
OCoLC |
| 005 |
20240329122006.0 |
| 006 |
m o d |
| 007 |
cr |n|---||||| |
| 008 |
170506s2016 xx o 000 0 eng d |
| 040 |
|
|
|a EBLCP
|b eng
|e pn
|c EBLCP
|d YDX
|d OCLCQ
|d LOA
|d OCLCO
|d OCLCF
|d K6U
|d OCLCQ
|d OCLCO
|d OCLCL
|
| 019 |
|
|
|a 985234627
|a 985310962
|a 985384545
|a 985484425
|a 986068682
|
| 020 |
|
|
|a 9781630814359
|
| 020 |
|
|
|a 1630814350
|
| 020 |
|
|
|z 1630811017
|
| 020 |
|
|
|z 9781630811013
|
| 029 |
1 |
|
|a AU@
|b 000071983780
|
| 035 |
|
|
|a (OCoLC)986371103
|z (OCoLC)985234627
|z (OCoLC)985310962
|z (OCoLC)985384545
|z (OCoLC)985484425
|z (OCoLC)986068682
|
| 050 |
|
4 |
|a TK7876
|b .C785 2017
|
| 082 |
0 |
4 |
|a 621.3813
|
| 049 |
|
|
|a UAMI
|
| 100 |
1 |
|
|a Cruickshank, David B.
|
| 245 |
1 |
0 |
|a Microwave Material Applications.
|
| 260 |
|
|
|a Norwood :
|b Artech House,
|c 2016.
|
| 300 |
|
|
|a 1 online resource (239 pages)
|
| 336 |
|
|
|a text
|b txt
|2 rdacontent
|
| 337 |
|
|
|a computer
|b c
|2 rdamedia
|
| 338 |
|
|
|a online resource
|b cr
|2 rdacarrier
|
| 490 |
1 |
|
|a Artech House microwave library
|
| 588 |
0 |
|
|a Print version record.
|
| 505 |
0 |
|
|a Microwave Material Applications: Device Miniaturization and Integration; Contents; Preface; Introduction; Acknowledgments; 1 New Magnetic Materials; 1.1 New High Magnetization Garnets for Microwave Magnetic Devices; 1.2 The Structure of Garnets; 1.3 The Magnetization and Curie Temperature of Bismuth-Substituted YIG; 1.4 Dielectric Constant and Bismuth Content; 1.5 Octahedral Substitution; 1.6 Comparison with Existing YIG-Based Materials; 1.7 Device Considerations; References; Selected Bibliography ; 2 New Magnetic Materials: Expanding Applications.
|
| 505 |
8 |
|
|a 2.1 Higher-Frequency Devices Using New Low-Magnetization Garnets2.2 Choice of Substitute Elements; 2.3 Nonmagnetic Tetrahedral Substitution; 2.4 Vanadium Substitution; 2.5 Aluminum Substitution; 2.6 Gadolinium Substitution ; 2.7 Comparison with Existing Materials; References; 3 Miniaturization of Ferrite Devices Using High Dielectric Constant Ferrite; 3.1 Description of the Junction Circulator Mode; 3.2 Experimental Proof of Size Reduction; 3.3 Device Implications of Dielectric Constant; 3.4 Miniaturization of Other Ferrite Devices.
|
| 505 |
8 |
|
|a 3.5 High Dielectric Constant Garnet and Latching and Switching Devices3.6 Low-Frequency Antennas; References; Selected Bibliography; 4 Dielectrics; 4.1 Background; 4.2 High Dielectric Constant Materials; 4.3 Perovskites; 4.4 Tetragonal Tungsten Bronze Dielectrics (TTBs); 4.5 Bismuth Niobium-Based Systems; 4.6 Summary of Candidate Dielectrics; 4.7 Low Dielectric Constant Materials (LTCC); 4.8 LTCC Integration; 4.9 Low Dielectric Constant MICs; 4.10 Low Dielectric Constant Soft-Substrate Hybrid Assembly; References; 5 Further Miniaturization with Combinations of Bismuth Garnets and Dielectrics.
|
| 505 |
8 |
|
|a 5.1 Introduction5.2 Above-Resonance Operation; 5.3 Below-Resonance Operation; 5.4 Microstrip Devices; References; Selected Bibliography; 6 Absorbers; 6.1 Introduction; 6.2 Low-Permittivity, Magnetic/Dielectric Composite Absorbers; 6.3 Ferroelectric Absorbers Based on BaTiO3; 6.4 Combinations of Ferroelectric and Magnetic Absorbers; 6.5 Commercial Absorbers as Loads; 6.6 New Materials Based on Magnetic Metal Combinations; 6.7 Ferrite-Based Absorbers; 6.8 Hexagonal Ferrites as Absorbers; 6.9 Ferrite Polymer Composites as Absorbers; 6.10 Alternate Ferroelectric Absorbers.
|
| 505 |
8 |
|
|a 6.11 Low-Temperature Firing Absorbers6.12 Very High-Power Absorbers; References; Selected Bibliography; 7 Dielectric and Magnetic Integration; 7.1 First Steps in Integration and Their Effect on Microwave Performance; 7.2 Nonmagnetic Garnets as Dielectric Substrates; 7.3 Combinations of Garnets; 7.4 Performance Enhancement: Insertion Loss and Intermodulation; 7.5 Other Sources of Insertion Loss in Magnetic Devices; 7.6 Intermodulation (IMD); 7.7 Below-Resonance IMD Reduction; 7.8 IMD in Dielectrics; 7.9 IMD and Harmonics in Systems; References; 8 Antennas; 8.1 Antenna Application Trends.
|
| 500 |
|
|
|a 8.2 MIMO and Massive MIMO.
|
| 590 |
|
|
|a ProQuest Ebook Central
|b Ebook Central Academic Complete
|
| 650 |
|
0 |
|a Microwave devices
|x Materials.
|
| 650 |
|
4 |
|a Microwave devices
|x Materials.
|
| 650 |
|
6 |
|a Dispositifs à micro-ondes
|x Matériaux.
|
| 650 |
|
7 |
|a Microwave devices
|x Materials
|2 fast
|
| 758 |
|
|
|i has work:
|a Microwave material applications (Text)
|1 https://id.oclc.org/worldcat/entity/E39PCFXFBgfQ3jFDTCrY6JKPgq
|4 https://id.oclc.org/worldcat/ontology/hasWork
|
| 776 |
0 |
8 |
|i Print version:
|a Cruickshank, David B.
|t Microwave Material Applications: Device Miniaturization and Integration.
|d Norwood : Artech House, ©2016
|z 9781630811013
|
| 830 |
|
0 |
|a Artech House microwave library.
|
| 856 |
4 |
0 |
|u https://ebookcentral.uam.elogim.com/lib/uam-ebooks/detail.action?docID=4845591
|z Texto completo
|
| 938 |
|
|
|a ProQuest Ebook Central
|b EBLB
|n EBL4845591
|
| 938 |
|
|
|a YBP Library Services
|b YANK
|n 14263788
|
| 994 |
|
|
|a 92
|b IZTAP
|
