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IMAPS Poland 2016.

Detalles Bibliográficos
Clasificación:	Libro Electrónico
Autor principal:	Goosey, Martin
Otros Autores:	Skwarek, Agata
Formato:	Electrónico eBook
Idioma:	Inglés
Publicado:	Bradford, West Yorkshire : Emerald Publishing Limited, 2017.
Colección:	Soldering & Surface Mount Technology.
Temas:	Microelectronic packaging > Congresses. Interconnects (Integrated circuit technology) > Congresses. Mise sous boîtier (Microélectronique) > Congrès. Interconnexions (Technologie des circuits intégrés) > Congrès. Interconnects (Integrated circuit technology) Microelectronic packaging Conference papers and proceedings
Acceso en línea:	Texto completo

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