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EBOOKCENTRAL_ocn979152273 |
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|a 978606630
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|a UAMI
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|a Goosey, Martin.
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| 245 |
1 |
0 |
|a IMAPS Poland 2016.
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| 260 |
|
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|a Bradford, West Yorkshire :
|b Emerald Publishing Limited,
|c 2017.
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| 300 |
|
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|a 1 online resource (69 pages)
|
| 336 |
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|a text
|b txt
|2 rdacontent
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|a Soldering & Surface Mount Technology ;
|v v. 29
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| 588 |
0 |
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|a Print version record.
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| 505 |
0 |
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|a Cover; Guest editorial; New method for determining correction factors for pin-in-paste solder volumes; Investigating the thixotropic behaviour of Type 4 solder paste during stencil printing; Optimization of solder paste quantity considering the properties of solder joints; The dependence of reliability and mechanical strength of the solder joints in 3D PoP structures from sizes of solder powders applied in soldering materials; X-ray inspection and Six-Sigma in analysis of LED thermal pad coverage; Studying heat transfer on inclined printed circuit boards during vapour phase soldering.
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| 505 |
8 |
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|a Real-time profiling of reflow process in VPS chamberStructure and thermal behavior of lead-free solders prepared by rapid solidification of their melt; Stability of electrical properties for mechanically exposed thick- and thin-film resistors on flexible substrates; Corrosion-induced tin whisker growth in electronic devices: a review.
|
| 590 |
|
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|a ProQuest Ebook Central
|b Ebook Central Academic Complete
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| 650 |
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0 |
|a Microelectronic packaging
|v Congresses.
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| 650 |
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0 |
|a Interconnects (Integrated circuit technology)
|v Congresses.
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| 650 |
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6 |
|a Mise sous boîtier (Microélectronique)
|v Congrès.
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| 650 |
|
6 |
|a Interconnexions (Technologie des circuits intégrés)
|v Congrès.
|
| 650 |
|
7 |
|a Interconnects (Integrated circuit technology)
|2 fast
|
| 650 |
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7 |
|a Microelectronic packaging
|2 fast
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| 655 |
|
7 |
|a Conference papers and proceedings
|2 fast
|
| 700 |
1 |
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|a Skwarek, Agata.
|
| 758 |
|
|
|i has work:
|a IMAPS Poland 2016 (Text)
|1 https://id.oclc.org/worldcat/entity/E39PCXG4VbKKtjwtj3DcThm9Qq
|4 https://id.oclc.org/worldcat/ontology/hasWork
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| 776 |
0 |
8 |
|i Print version:
|a Goosey, Martin.
|t IMAPS Poland 2016.
|d Bradford, West Yorkshire : Emerald Publishing Limited, ©2017
|z 9781787143951
|
| 830 |
|
0 |
|a Soldering & Surface Mount Technology.
|
| 856 |
4 |
0 |
|u https://ebookcentral.uam.elogim.com/lib/uam-ebooks/detail.action?docID=4825319
|z Texto completo
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|b IDEB
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|b YANK
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