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|a UAMI
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|a Baoyong, Chi.
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1 |
0 |
|a IMAPS (2016).
|
| 260 |
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|a Bradford, West Yorkshire :
|b Emerald Publishing Limited,
|c 2017.
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| 300 |
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|a 1 online resource (45 pages)
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|a text
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|a Circuit World ;
|v v. 43
|
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|a Print version record.
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|a Cover; Guest editorial; Investigation of nano-inks' behaviour on flexible and rigid substrates under various conditions; Mechanical and thermal reliability of conductive circuits inkjet printed on flexible substrates; Drops forming in inkjet printing of flexible electronic circuits; Assessment of stability and reliability of embedded components in printed circuit boards; Effects of varying laser trimming geometries on thin film resistors; RFID monitoring system of fiber optic connectors; Investigations of mutual thermal coupling between SiC Schottky diodes situated in the common case.
|
| 590 |
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|a ProQuest Ebook Central
|b Ebook Central Academic Complete
|
| 650 |
|
0 |
|a Microelectronic packaging
|v Congresses.
|
| 650 |
|
0 |
|a Interconnects (Integrated circuit technology)
|v Congresses.
|
| 650 |
|
6 |
|a Mise sous boîtier (Microélectronique)
|v Congrès.
|
| 650 |
|
6 |
|a Interconnexions (Technologie des circuits intégrés)
|v Congrès.
|
| 650 |
|
7 |
|a Interconnects (Integrated circuit technology)
|2 fast
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| 650 |
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7 |
|a Microelectronic packaging
|2 fast
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| 655 |
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7 |
|a Conference papers and proceedings
|2 fast
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| 700 |
1 |
|
|a Skwarek, Agata.
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| 758 |
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|i has work:
|a IMAPS (2016) (Text)
|1 https://id.oclc.org/worldcat/entity/E39PD39MGPqY68H9jcr6WcmhMd
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|i Print version:
|a Baoyong, Chi.
|t IMAPS (2016).
|d Bradford, West Yorkshire : Emerald Publishing Limited, ©2017
|z 9781787143975
|
| 830 |
|
0 |
|a Circuit World.
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|u https://ebookcentral.uam.elogim.com/lib/uam-ebooks/detail.action?docID=4825320
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