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Ultra-precision machining process and surface finishing technology : selected, peer reviewed papers fromt he 10th CHINA-JAPAN International Conference on Ultra-Precision Machining Process (10th CJUMP) and 2014 International Conference on Surface Finishing Technology (ICSFT 2014), October 17-19, 2014, Jiaozuo, China /
Collection of selected, peer reviewed papers from the 10th CHINA-JAPAN International Conference on Ultra-Precision Machining Process (10th CJUMP) and 2014 International Conference on Surface Finishing Technology (ICSFT 2014), October 17-19, 2014, Jiaozuo, China. The 76 papers are grouped as follows:...
| Clasificación: | Libro Electrónico |
|---|---|
| Otros Autores: | |
| Formato: | Electrónico eBook |
| Idioma: | Inglés |
| Publicado: |
Pfaffikon, Switzerland :
Trans Tech Publications Ltd,
2014.
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| Colección: | Advanced materials research ;
Volume 1027. |
| Temas: | |
| Acceso en línea: | Texto completo |
Tabla de Contenidos:
- Ultra-Precision Machining Process and Surface Finishing Technology; Preface, Organization and Sponsors; Table of Contents; Chapter 1: Ultra-Precision Machining Process and Instrumentation; Effects of Processing Parameters of Oxide Layer in Ultrasonic Vibration and Electrolytic In-Process Dressing Combined Grinding; An Experimental Investigation of Temperatures in Grinding of Ceramics with a Brazed Diamond Tool; Analysis and Simulation of Air Flow Field Surrounding Grinding Wheel; Design and Test of Piezoelectric Tool Actuator on Ultra-Precision Machine Tool for KDP Crystals
- An Optimal Method of Tool Path Generation for Radial Sinusoidal SurfaceDesign Method of Gear Form Grinding Machine Based on QFD and AHP; Analysis of Temperature and Thermal Stress Distribution on KDP Crystal Wire Saw Slicing; Diamond Tool Wear Reduction by Combining Ultrasonic Elliptical Vibration with Graphite Particle Atmosphere; Tool Wear Properties of Diamond-Cutting Ferrous Metal; The Research and Development on the Material Removal Mechanism of the Ultrasonic Cutting; The Pressure Field Radiated by Cavitation Bubble in the Grinding Area of Power Ultrasonic Honing
- Study on Grinding Force of High Volume Fraction SiCp/Al Composites with Rotary Ultrasonic Vibration GrindingStudy on Polishing Technology for Hard-Brittle Materials by a Micro Abrasive Water Jet; Study on Process Parameters in CMP Ultra-Thin Stainless Steel Sheet; The Finite Element Analysis for Ultra-Precision Single-Plane Lapping Machine Bed; Lapping and Polishing of Sapphire Wafer with Fixed Abrasive Pad; Machining Mechanism of Fresnel Lens Mold; Optimization of Milling Parameters of CFRP for Surface Roughness Using Taguchi Design Method
- Oxidant for Chemical Mechanical Polishing of Single Crystal DiamondPerformance of Brazed Diamond Tool for Machining Dental Ceramic; Process Experiment Research and Equipment Development of ELID Lapping; Design of Lapping Paste in Lapping 304 Ultra-Thin Stainless Steel Sheet; Research on Cylindrical Precision Machining Adopting ELID Grinding Technology; Research on Elastic-Plastic Transition and Hardening Effect for Monocrystalline Silicon Surfaces; Research on ELID Grinding Efficient Surface Forming Mechanism of SiCp/Al Composites
- Research on the Laws of Wear Rate of Grinding Block in Grinding SiCSimulation of Ground Surface Residual Stress for Surface Integrity in Small Depth of Cut; Influence of Grinding Parameters on Residual Stress of Nano-ZrO2 Ceramics; Experimental Study on Removal Characteristics of Ceramic Materials in Ultrasonic Aided High Efficiency Lapping; Experimental Investigation on Grinding Temperature of Titanium Alloy; Study on the Effect of Vibration Amplitude in Two-Dimension Ultrasonic Vibration Cutting; In Situ Measurement and Compensation Turning Technique of Deep MgF2 Conformal Dome