Future trends in microelectronics. Journey into the unknown /

Presents the developments in microelectronic-related fields, with comprehensive insight from a number of leading industry professionals The book presents the future developments and innovations in the developing field of microelectronics. The book’s chapters contain contributions from vari...

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Detalles Bibliográficos
Clasificación:Libro Electrónico
Otros Autores: Luryi, Serge (Editor ), Xu, Jimmy (Editor ), Zaslavsky, Alex, 1963- (Editor )
Formato: Electrónico eBook
Idioma:Inglés
Publicado: Hoboken, New Jersey : John Wiley & Sons, 2016.
Temas:
Microelectronics > Technological innovations.
Nanotechnology > Technological innovations.
Semiconductors > Technological innovations.
Microélectronique > Innovations.
Semi-conducteurs > Innovations.
Nanotechnologie > Innovations.
TECHNOLOGY & ENGINEERING > Mechanical.
Microelectronics > Technological innovations
Acceso en línea:Texto completo
Tabla de Contenidos:
  • Cover ; Title Page ; Copyright ; Contents ; List of Contributors ; Preface ; Acknowledgments ; Part I Future of Digital Silicon; 1.1 Prospects of Future Si Technologies in the Data-Driven World; 1. Introduction ; 2. Memory
  • DRAM ; 3. Memory
  • NAND ; 4. Logic technology ; 5. CMOS image sensors ; 6. Packaging technology.
  • 7. Silicon photonics technology 8. Concluding remarks ; Acknowledgments ; References ; 1.2 How Lithography Enables Moore's Law; 1. Introduction ; 2. Moore's Law and the contribution of lithography ; 3. Lithography technology: past and present ; 4. Lithography technology: future ; 5. Summary.
  • 6. Conclusion Acknowledgments ; References ; 1.3 What Happened to Post-CMOS?; 1. Introduction ; 2. General constraints on speed and energy ; 3. Guidelines for success ; 4. Benchmarking and examples ; 5. Discussion ; 6. Conclusion ; Acknowledgments ; References.
  • 1.4 Three-Dimensional Integration of Ge and Two-Dimensional Materials for One-Dimensional Devices1. Introduction ; 2. FEOL technology and materials for 3D integration ; 3. Integration of ""more than Moore"" functionality ; 4. Implications of 3D integration at the system level ; 5. Conclusion ; Acknowledgments ; References.
  • 1.5 Challenges to Ultralow-Power Semiconductor Device Operation1. Introduction ; 2. Ultimate MOS transistors ; 3. Small slope switches ; 4. Conclusion ; Acknowledgments ; References ; 1.6 A Universal Nonvolatile Processing Environment; 1. Introduction ; 2. Universal nonvolatile processing environment.

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