Cargando…
Mitigating tin whisker risks : theory and practice /
This book covers key tin whisker topics, ranging from fundamental science to practical mitigation strategies. The text begins with a review of the characteristic properties of local microstructures around whisker and hillock grains to identify why these particular grains and locations become predisp...
| Clasificación: | Libro Electrónico |
|---|---|
| Otros Autores: | , , |
| Formato: | Electrónico eBook |
| Idioma: | Inglés |
| Publicado: |
Hoboken, New Jersey :
John Wiley & Sons, Inc.,
[2016]
|
| Temas: | |
| Acceso en línea: | Texto completo |
Tabla de Contenidos:
- TITLE PAGE; COPYRIGHT; TABLE OF CONTENTS; LIST OF CONTRIBUTORS; INTRODUCTION; 1 A PREDICTIVE MODEL FOR WHISKER FORMATION BASED ON LOCAL MICROSTRUCTURE AND GRAIN BOUNDARY PROPERTIES; 1.1 INTRODUCTION; 1.2 CHARACTERISTICS OF WHISKER AND HILLOCK GROWTH FROM SURFACE GRAINS; 1.3 SUMMARY AND RECOMMENDATIONS; ACKNOWLEDGMENTS; REFERENCES; 2 MAJOR DRIVING FORCES AND GROWTH MECHANISMS FOR TIN WHISKERS; 2.1 INTRODUCTION; 2.2 UNDERSTANDING THE MECHANISMS BEHIND IMC-INDUCED STRESS EVOLUTION AND WHISKER GROWTH; 2.3 RELATION OF STRESS TO WHISKER GROWTH; 2.4 CONCLUSIONS; ACKNOWLEDGMENTS; REFERENCES.
- 3 APPROACHES OF MODELING AND SIMULATION OF STRESSES IN Sn FINISHES3.1 INTRODUCTION; 3.2 CONSTITUTIVE MODEL; 3.3 STRAIN ENERGY DENSITY; 3.4 GRAIN ORIENTATION; 3.5 FINITE ELEMENT MODELING OF TRIPLE-GRAIN JUNCTION; 3.6 FINITE ELEMENT MODELING OF S FINISH WITH MULTIPLE GRAINS; REFERENCES; 4 PROPERTIES AND WHISKER FORMATION BEHAVIOR OF TIN-BASED ALLOY FINISHES; 4.1 INTRODUCTION; 4.2 GENERAL PROPERTIES OF TIN-BASED ALLOY FINISHES (ASAO NISHIMURA); 4.3 EFFECT OF ALLOYING ELEMENTS ON WHISKER FORMATION AND MITIGATION (ASAO NISHIMURA).
- 4.4 DEPENDENCE OF WHISKER PROPENSITY OF MATTE TIN-COPPER FINISH ON COPPER LEAD-FRAME MATERIAL (TAKAHIKO KATO)4.5 CONCLUSIONS; ACKNOWLEDGMENTS; REFERENCES; 5 CHARACTERIZATION TECHNIQUES FOR FILM CHARACTERISTICS; 5.1 INTRODUCTION; 5.2 TEM (TAKAHIKO KATO); 5.3 SEM (YUKIKO MIZUGUCHI); 5.4 EBSD (YUKIKO MIZUGUCHI); 5.5 CONCLUSIONS; ACKNOWLEDGMENTS; REFERENCES; 6 OVERVIEW OF WHISKER-MITIGATION STRATEGIES FOR HIGH-RELIABILITY ELECTRONIC SYSTEMS; 6.1 OVERVIEW OF TIN WHISKER RISK MANAGEMENT; 6.2 DETAILS OF TIN WHISKER MITIGATION; 6.3 MANAGING TIN WHISKER RISKS AT THE SYSTEM LEVEL.
- 6.4 CONTROL OF SUBCONTRACTORS AND SUPPLIERS6.5 CONCLUSIONS; REFERENCES; 7 QUANTITATIVE ASSESSMENT OF STRESS RELAXATION IN TIN FILMS BY THE FORMATION OF WHISKERS, HILLOCKS, AND OTHER SURFACE DEFECTS; 7.1 INTRODUCTION; 7.2 SURFACE-DEFECT CLASSIFICATION AND MEASUREMENT METHOD; 7.3 PREPARATION AND STORAGE CONDITIONS OF ELECTROPLATED FILMS ON SUBSTRATES; 7.4 SURFACE DEFECT FORMATION AS A FUNCTION OF TIN FILM TYPE, SUBSTRATE, AND STORAGE CONDITION; 7.5 CONCLUSIONS; APPENDIX; ACKNOWLEDGMENTS; REFERENCES; 8 BOARD REFLOW PROCESSES AND THEIR EFFECT ON TIN WHISKER GROWTH; 8.1 INTRODUCTION.
- 8.2 THE EFFECT OF REFLOWED COMPONENTS ON TIN WHISKER GROWTH IN TERMS OF GRAIN SIZE AND GRAIN ORIENTATION DISTRIBUTION8.3 REFLOW PROFILES AND THE EFFECT ON TIN WHISKER GROWTH; 8.4 INFLUENCE OF REFLOW ATMOSPHERE AND FLUX ON TIN WHISKER GROWTH; 8.5 EFFECT OF SOLDER PASTE VOLUME ON COMPONENT TIN WHISKER GROWTH DURING ELECTRONICS ASSEMBLY; 8.6 CONCLUSIONS; ACKNOWLEDGMENTS; REFERENCES; 9 MECHANICALLY INDUCED TIN WHISKERS; 9.1 INTRODUCTION; 9.2 OVERVIEW OF MECHANICALLY INDUCED TIN WHISKER FORMATION; 9.3 THEORY; 9.4 CASE STUDIES; 9.5 CONCLUSIONS; REFERENCES; INDEX; END USER LICENSE AGREEMENT.