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Particles on surfaces 8 : Detection, adhesion and removal.
This work documents the proceedings of the 8th International Symposium on Particles on Surfaces - Detection, Adhesion and Removal, held in Providence, Rhode Island, from June 24-26, 2002. Topics include nature and characterization of small particles, and particle deposition during immersion rinsing.
| Clasificación: | Libro Electrónico |
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| Autor principal: | |
| Formato: | Electrónico eBook |
| Idioma: | Inglés |
| Publicado: |
Leiden :
BRILL,
2003.
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| Temas: | |
| Acceso en línea: | Texto completo |
Tabla de Contenidos:
- Preface; Part 1: Particle Analysis / Characterization and General Cleaning-Related Topics; The nature and characterization of small particles; Surface and micro-analytical methods for particle identification; The haze of a wafer: A new approach to monitor nano-sized particles; Particle transport and adhesion in an ultra-clean ion-beam sputter deposition process; Particle deposition from a carry-over layer during immersion rinsing; The use of surfactants to reduce particulate contamination on surfaces; The use of rectangular jets for surface decontamination.
- Ice-air blast cleaning: Case studiesDevelopment of a technique for glass cleaning in the course of demanufacturing of electronic products; Part 2: Particle Adhesion and Removal; Mechanics of nanoparticle adhesion
- A continuum approach; A new thermodynamic theory of adhesion of particles on surfaces; Particle adhesion on nanoscale rough surfaces; Advanced wet cleaning of sub-micrometer sized particles; Modified SC-1 solutions for silicon wafer cleaning; Investigation of ozonated DI water in semiconductor wafer cleaning; Possible post-CMP cleaning processes for STI ceria slurries.
- The ideal ultrasonic parameters for delicate parts cleaningEffects of megasonics coupled with SC-1 process parameters on particle removal on 300-mm silicon wafers; Influences of various parameters on microparticles removal during laser surface cleaning; Particle removal with pulsed-laser induced plasma over an extended area of a silicon wafer; Particle removal by collisions with energetic clusters.