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Materials for High-Density Electronic Packaging and Interconnection.
| Clasificación: | Libro Electrónico |
|---|---|
| Autor principal: | |
| Formato: | Electrónico eBook |
| Idioma: | Inglés |
| Publicado: |
Washington :
National Academies Press,
1900.
|
| Temas: | |
| Acceso en línea: | Texto completo |
Tabla de Contenidos:
- ""Materials for High-Density Electronic Packaging and Interconnection""; ""Copyright""; ""Abstract""; ""Preface""; ""Acknowledgments""; ""MEETING 1""; ""MEETING 2""; ""MEETING 3""; ""Contents""; ""Executive Summary""; ""Chapter 1 Introduction""; ""Chapter 2 Microelectronic System Trends and Packaging Needs""; ""SCALING THEORY""; ""Lithography""; ""Scaling of Mosfets""; ""Scaling of CMOS""; ""Scaling of Bipolars""; ""GALLUM ARSENIED TECHNOLOGY""; ""RENT'S RULE""; ""CHIP TECHNOLOGIES""; ""Chip Interface Packaging""; ""Chip Interconnection Packaging""; ""SOME PACKAGE DESIGN CONSIDERATIONS""
- ""Single-Chip Modules""""Multichip Modules""; ""REFERENCES""; ""Chapter 3 Packaging Strategies and Associated Materials and Process Requirements ""; ""PRESENT PACKAGING APPROACHES""; ""Single-Chip Modules on Printed Wiring Boards""; ""Thick-Film Multichip Modules Using Ceramic Dielectrics""; ""FUTURE PACKAGING STRATEGIES""; ""Thin-Film Multichip Modules Using Polymeric Dielectrics""; ""References for Table 3-1:""; ""Wafer-Scale Integration""; ""PACKAGING MATERIALS REQUIREMENTS""; ""SUMMARY OF FUTURE PACKAGING MATERIALS AND PROCESSES NEEDS""; ""Chapter 4 Materials Issues""
- ""DISSIPATION OF HIGH THERMAL LOADS""""DIELECTRIC PROPERTIES""; ""INTERCONNECT VOIDING""; ""THERMAL FATIGUE""; ""INTERFACIAL PROCESSES""; ""HIGH-TEMPERATURE STABILITY AND CHEMICAL REACTIONS""; ""TRACE RADIONUCLIDES IN PACKAGING MATERIALS""; ""ELECTROMAGNETIC INTERFERENCE""; ""ENCAPSULANTS AND HERMETICITY""; ""MATERIALS-RELATED RELIABILITY ISSUES""; ""MILITARY PACKAGING""; ""REFERENCES""; ""Chapter 5 Some Specific Materials""; ""THE EVOLUTION OF EPOXY MATERIALS IN PLASTIC PACKAGING""; ""Epoxy Versus Silicone Materials""; ""Low-Stress Materials""; ""Low-Alpha Materials""
- ""Processing Improvements""""Market Shares of the Major Molding Compound Suppliers""; ""FUTURE TRENDS IN PLASTIC PACKAGING MATERIALS""; ""Surface-Mount Technology""; ""Very High Pin Count Packages""; ""Heat Dissipation""; ""Plastic Alternatives to Epoxy Encapsulation""; ""ORGANIC PRINTED CIRCUIT BOARD MATERIALS""; ""PROCESSING TECHNOLOGY FOR CERAMIC PACKAGES, BOARDS, AND SUBSTRATES""; ""Dry Pressing""; ""The Ceramic Tape Process""; ""Screen Printing""; ""OTHER CERAMIC MATERIALS""; ""Glass and Porcelain""; ""Low-Fire Materials""; ""Low-Dielectric-Constant Materials""
- ""High-Thermal-Conductivity Materials""""POLYIMIDES IN HIGH-DENSITY PACKAGING""; ""Trends in High-Density Packaging""; ""Polyimide Processing""; ""Polyimides and Properties for High-Density Interconnection""; ""Photosensitive Polyimides""; ""General Availability of Technical Information on Polyimides""; ""Polymers in Future High-Density Interconnection Technologies""; ""TAPE AUTOMATED BONDING""; ""DIAMOND""; ""SUPERCONDUCTORS""; ""COMPOSITES""; ""MATERIALS FOR VERY-HIGH-FREQUENCY DIGITAL SYSTEMS""; ""MATERIALS FOR CONNECTOR APPLICATIONS""; ""THE THERMAL CONDUCTION MODULE""; ""REFERENCES""