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Materials for High-Density Electronic Packaging and Interconnection.

Detalles Bibliográficos
Clasificación:	Libro Electrónico
Autor principal:	Packaging, Committee on Materials for High-Density Electronic
Formato:	Electrónico eBook
Idioma:	Inglés
Publicado:	Washington : National Academies Press, 1900.
Temas:	Electronic packaging > Materials. Electrical engineering > Materials. Mise sous boîtier (Électronique) > Matériaux. Génie électrique > Matériaux. Electrical engineering > Materials Electronic packaging > Materials
Acceso en línea:	Texto completo

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