|
|
|
|
| LEADER |
00000cam a2200000Mu 4500 |
| 001 |
EBOOKCENTRAL_ocn923266410 |
| 003 |
OCoLC |
| 005 |
20240329122006.0 |
| 006 |
m o d |
| 007 |
cr |n||||||||| |
| 008 |
151010s1900 dcu o 000 0 eng d |
| 040 |
|
|
|a EBLCP
|b eng
|e pn
|c EBLCP
|d OCLCQ
|d MERUC
|d OCLCQ
|d ZCU
|d ICG
|d OCLCO
|d OCLCF
|d OCLCQ
|d DKC
|d AU@
|d OCLCO
|d OCLCQ
|d OCLCO
|d OCLCQ
|d OCLCO
|
| 020 |
|
|
|a 9780309536691
|
| 020 |
|
|
|a 0309536693
|
| 029 |
1 |
|
|a DEBBG
|b BV044107533
|
| 035 |
|
|
|a (OCoLC)923266410
|
| 050 |
|
4 |
|a TK7870
|
| 082 |
0 |
4 |
|a 621.381046
|
| 049 |
|
|
|a UAMI
|
| 100 |
1 |
|
|a Packaging, Committee on Materials for High-Density Electronic.
|
| 245 |
1 |
0 |
|a Materials for High-Density Electronic Packaging and Interconnection.
|
| 260 |
|
|
|a Washington :
|b National Academies Press,
|c 1900.
|
| 300 |
|
|
|a 1 online resource (156 pages)
|
| 336 |
|
|
|a text
|b txt
|2 rdacontent
|
| 337 |
|
|
|a computer
|b c
|2 rdamedia
|
| 338 |
|
|
|a online resource
|b cr
|2 rdacarrier
|
| 588 |
0 |
|
|a Print version record.
|
| 505 |
0 |
|
|a ""Materials for High-Density Electronic Packaging and Interconnection""; ""Copyright""; ""Abstract""; ""Preface""; ""Acknowledgments""; ""MEETING 1""; ""MEETING 2""; ""MEETING 3""; ""Contents""; ""Executive Summary""; ""Chapter 1 Introduction""; ""Chapter 2 Microelectronic System Trends and Packaging Needs""; ""SCALING THEORY""; ""Lithography""; ""Scaling of Mosfets""; ""Scaling of CMOS""; ""Scaling of Bipolars""; ""GALLUM ARSENIED TECHNOLOGY""; ""RENT'S RULE""; ""CHIP TECHNOLOGIES""; ""Chip Interface Packaging""; ""Chip Interconnection Packaging""; ""SOME PACKAGE DESIGN CONSIDERATIONS""
|
| 505 |
8 |
|
|a ""Single-Chip Modules""""Multichip Modules""; ""REFERENCES""; ""Chapter 3 Packaging Strategies and Associated Materials and Process Requirements ""; ""PRESENT PACKAGING APPROACHES""; ""Single-Chip Modules on Printed Wiring Boards""; ""Thick-Film Multichip Modules Using Ceramic Dielectrics""; ""FUTURE PACKAGING STRATEGIES""; ""Thin-Film Multichip Modules Using Polymeric Dielectrics""; ""References for Table 3-1:""; ""Wafer-Scale Integration""; ""PACKAGING MATERIALS REQUIREMENTS""; ""SUMMARY OF FUTURE PACKAGING MATERIALS AND PROCESSES NEEDS""; ""Chapter 4 Materials Issues""
|
| 505 |
8 |
|
|a ""DISSIPATION OF HIGH THERMAL LOADS""""DIELECTRIC PROPERTIES""; ""INTERCONNECT VOIDING""; ""THERMAL FATIGUE""; ""INTERFACIAL PROCESSES""; ""HIGH-TEMPERATURE STABILITY AND CHEMICAL REACTIONS""; ""TRACE RADIONUCLIDES IN PACKAGING MATERIALS""; ""ELECTROMAGNETIC INTERFERENCE""; ""ENCAPSULANTS AND HERMETICITY""; ""MATERIALS-RELATED RELIABILITY ISSUES""; ""MILITARY PACKAGING""; ""REFERENCES""; ""Chapter 5 Some Specific Materials""; ""THE EVOLUTION OF EPOXY MATERIALS IN PLASTIC PACKAGING""; ""Epoxy Versus Silicone Materials""; ""Low-Stress Materials""; ""Low-Alpha Materials""
|
| 505 |
8 |
|
|a ""Processing Improvements""""Market Shares of the Major Molding Compound Suppliers""; ""FUTURE TRENDS IN PLASTIC PACKAGING MATERIALS""; ""Surface-Mount Technology""; ""Very High Pin Count Packages""; ""Heat Dissipation""; ""Plastic Alternatives to Epoxy Encapsulation""; ""ORGANIC PRINTED CIRCUIT BOARD MATERIALS""; ""PROCESSING TECHNOLOGY FOR CERAMIC PACKAGES, BOARDS, AND SUBSTRATES""; ""Dry Pressing""; ""The Ceramic Tape Process""; ""Screen Printing""; ""OTHER CERAMIC MATERIALS""; ""Glass and Porcelain""; ""Low-Fire Materials""; ""Low-Dielectric-Constant Materials""
|
| 505 |
8 |
|
|a ""High-Thermal-Conductivity Materials""""POLYIMIDES IN HIGH-DENSITY PACKAGING""; ""Trends in High-Density Packaging""; ""Polyimide Processing""; ""Polyimides and Properties for High-Density Interconnection""; ""Photosensitive Polyimides""; ""General Availability of Technical Information on Polyimides""; ""Polymers in Future High-Density Interconnection Technologies""; ""TAPE AUTOMATED BONDING""; ""DIAMOND""; ""SUPERCONDUCTORS""; ""COMPOSITES""; ""MATERIALS FOR VERY-HIGH-FREQUENCY DIGITAL SYSTEMS""; ""MATERIALS FOR CONNECTOR APPLICATIONS""; ""THE THERMAL CONDUCTION MODULE""; ""REFERENCES""
|
| 500 |
|
|
|a ""Chapter 6 Organizational, Funding, and Policy Issues""
|
| 590 |
|
|
|a ProQuest Ebook Central
|b Ebook Central Academic Complete
|
| 650 |
|
0 |
|a Electronic packaging
|x Materials.
|
| 650 |
|
0 |
|a Electrical engineering
|x Materials.
|
| 650 |
|
6 |
|a Mise sous boîtier (Électronique)
|x Matériaux.
|
| 650 |
|
6 |
|a Génie électrique
|x Matériaux.
|
| 650 |
|
7 |
|a Electrical engineering
|x Materials
|2 fast
|
| 650 |
|
7 |
|a Electronic packaging
|x Materials
|2 fast
|
| 776 |
0 |
8 |
|i Print version:
|a Packaging, Committee on Materials for High-Density Electronic.
|t Materials for High-Density Electronic Packaging and Interconnection.
|d Washington : National Academies Press, ©1900
|z 9780309042338
|
| 856 |
4 |
0 |
|u https://ebookcentral.uam.elogim.com/lib/uam-ebooks/detail.action?docID=3376830
|z Texto completo
|
| 938 |
|
|
|a ProQuest Ebook Central
|b EBLB
|n EBL3376830
|
| 994 |
|
|
|a 92
|b IZTAP
|
