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Microelectromechanical Systems : Advanced Materials and Fabrication Methods.
| Clasificación: | Libro Electrónico |
|---|---|
| Autor principal: | |
| Formato: | Electrónico eBook |
| Idioma: | Inglés |
| Publicado: |
Washington :
National Academies Press,
1997.
|
| Temas: | |
| Acceso en línea: | Texto completo |
Tabla de Contenidos:
- ""Microelectromechanical Systems""; ""Copyright""; ""Acknowledgments""; ""Preface""; ""Contents""; ""Acronyms""; ""Executive Summary""; ""LEVERAGING AND EXTENDING THE INTEGRATED CIRCUITS FOUNDATION""; ""ENLARGING THE SUITE OF MATERIALS SUITABLE FOR INTEGRATED-CIRCUIT-LIKE PROCESSING""; ""CHARACTERIZING MEMS MATERIALS""; ""UNDERSTANDING SURFACE AND INTERFACE EFFECTS""; ""ETCHING TECHNOLOGIES""; ""ESTABLISHING STANDARD TEST DEVICES AND METHODS""; ""MEMS PACKAGING""; ""FOUNDRY AND COMPUTER-AIDED DESIGN INFRASTRUCTURE FOR MEMS""; ""ACADEMIC STRUCTURE TO SUPPORT MEMS""; ""1 Background""
- ""COMMERCIAL SUCCESSES""""Thermal Ink-Jet Printing""; ""Accelerometers""; ""NEWLY INTRODUCED PRODUCTS""; ""High-Resolution Displays""; ""Chemical-Sensing Arrays""; ""LONGER-RANGE OPPORTUNITIES""; ""Transportation""; ""Biomedical and Health Care""; ""Information Technology""; ""Defense""; ""SUMMARY""; ""2 Integrated Circuit-Based Fabrication Technologies and Materials""; ""STRENGTHS OF THE INTEGRATED CIRCUIT PROCESS""; ""USING EXISTING INTEGRATED CIRCUIT-BASED PROCESSES""; ""Bulk Micromachining Processes""; ""Bulk Micromachining for MEMS with Electronics""; ""Surface Micromachining Processes""
- ""Surface Micromachining to Produce Multilevel MEMS""""CLASSIFYING INTEGRATED CIRCUIT-BASED TECHNOLOGIES""; ""MEMS with Old Materials and Old Tools""; ""MEMS with Old Materials and New Tools""; ""MEMS with New Materials and Old Tools""; ""MEMS with New Materials and New Tools""; ""SUMMARY""; ""3 New Materials and Processes""; ""MOTIVATIONS FOR NEW TECHNOLOGIES""; ""MATERIALS AND PROCESSES FOR HIGH-ASPECT-RATIO STRUCTURES""; ""HEXSIL""; ""LIGA""; ""Compatibility and Manufacturing Constraints of LIGA""; ""MATERIALS AND PROCESSES FOR ENHANCED-FORCE MICROACTUATION""; ""Materials""
- ""Magnetic Thin-Films""""Piezoelectric Films""; ""Shape-Memory Alloys""; ""Shape-Memory Polymers""; ""Magnetostrictive Alloys""; ""Processing""; ""Processing Multilayer Ceramics""; ""Thin-Film Processing""; ""FILMS FOR USE IN SEVERE ENVIRONMENTS: SILICON CARBIDE AND DIAMOND""; ""Silicon Carbide""; ""Diamond""; ""SURFACE MODIFICATIONS/COATINGS""; ""Plasma-Deposited Polymers""; ""Polyimides""; ""Conducting Polymers""; ""POWER SUPPLIES""; ""SUMMARY""; ""4 Designing Microelectromechanical Systems ""; ""METROLOGY""; ""MODELING""; ""COMPUTER-AIDED DESIGN SYSTEMS""; ""FOUNDRY INFRASTRUCTURE""
- ""SUMMARY""""5 Assembly, Packaging, and Testing""; ""CONTRASTS BETWEEN ASSEMBLY, PACKAGING, AND TESTING OF INTEGRATED CIRCUITS AND MICROELECTROMECHANICAL ... ""; ""INTERFACES""; ""Biomedical Interfaces""; ""Optical Interfaces""; ""Electrical Power""; ""Fluidics""; ""Mechanical Interfaces""; ""PACKAGING""; ""Handling Issues""; ""Dicing""; ""Cleanliness""; ""Stiction""; ""Packaging Materials""; ""Stresses on Packaging""; ""Fluid Environment""; ""Vacuum Packaging""; ""ASSEMBLY""; ""Hybrid Assembly""; ""Assembly of Micromechanical Parts""; ""STANDARDS, TESTING, AND RELIABILITY""