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Foundations for microstrip circuit design /
| Clasificación: | Libro Electrónico |
|---|---|
| Autores principales: | , |
| Formato: | Electrónico eBook |
| Idioma: | Inglés |
| Publicado: |
Chichester, West Sussex, United Kingdom :
John Wiley & Sons Inc.,
2016.
|
| Edición: | Fourth edition. |
| Temas: | |
| Acceso en línea: | Texto completo |
Tabla de Contenidos:
- Title Page; Copyright; List of Trademarks; Dedication; Table of Contents; Preface; Acknowledgements; Chapter 1: Introduction to Design Using Microstrip and Planar Lines; 1.1 Introduction; 1.2 Origins of Microstrip; 1.3 RF and Microwave Modules; 1.4 Interconnections on RF and Microwave Integrated Circuits; 1.5 High-speed Digital Interconnections; 1.6 Summary; References; Chapter 2: Fundamentals of Signal Transmission on Interconnects; 2.1 Introduction; 2.2 Transmission Lines and Interconnects; 2.3 Interconnects as Part of a Packaging Hierarchy; 2.4 The Physical Basis of Interconnects.
- 2.5 The Physics, a Guided Wave2.6 When an Interconnect Should be Treated as a Transmission Line; 2.7 The Concept of RF Transmission Lines; 2.8 Primary Transmission Line Constants; 2.9 Secondary Constants for Transmission Lines; 2.10 Transmission Line Impedances; 2.11 Reflection; 2.12 Multiple Conductors; 2.13 Return Currents; 2.14 Modeling of Interconnects; 2.15 Summary; References; Chapter 3: Microwave Network Analysis; 3.1 Introduction; 3.2 Two-port Networks; 3.3 Scattering Parameter Theory; 3.4 Signal-flow Graph Techniques and S Parameters; 3.5 Summary; References.
- Chapter 4: Transmission Line Theory4.1 Introduction; 4.2 Transmission Line Theory; 4.3 Chain (ABCD) Parameters for a Uniform Length of Loss-free Transmission Line; 4.4 Change in Reference Plane; 4.5 Working With a Complex Characteristic Impedance; 4.6 Summary; References; Chapter 5: Planar Interconnect Technologies; 5.1 Introductory Remarks; 5.2 Microwave Frequencies and Applications; 5.3 Transmission Line Structures; 5.4 Substrates for Planar Transmission Lines; 5.5 Thin-film Modules; 5.6 Thick-film Modules; 5.7 Monolithic Technology; 5.8 Printed Circuit Boards; 5.9 Multichip Modules.
- 5.10 SummaryReferences; Chapter 6: Microstrip Design at Low Frequencies; 6.1 The Microstrip Design Problem; 6.2 The Quasi-TEM Mode of Propagation; 6.3 Static-TEM Parameters; 6.4 Effective Permittivity and Characteristic Impedance of Microstrip; 6.5 Filling Factor; 6.6 Approximate Graphically Based Synthesis; 6.7 Formulas for Accurate Static-TEM Design Calculations; 6.8 Electromagnetic Analysis-based Techniques; 6.9 A Worked Example of Static-TEM Synthesis; 6.10 Microstrip on a Dielectrically Anisotropic Substrate; 6.11 Microstrip and Magnetic Materials.
- 6.12 Effects of Finite Strip Thickness, Metallic Enclosure, and Manufacturing Tolerances6.13 Pulse Propagation along Microstrip Lines; 6.14 Recommendations Relating to the Static-TEM Approaches; 6.15 Summary; References; Chapter 7: Microstrip at High Frequencies; 7.1 Introduction; 7.2 Frequency-dependent Effects; 7.3 Approximate Calculations Accounting for Dispersion; 7.4 Accurate Design Formulas; 7.5 Effects due to Ferrite and to Dielectrically Anisotropic Substrates; 7.6 Field Solutions; 7.7 Frequency Dependence of Microstrip Characteristic Impedance.