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|a Materials and failures in MEMS and NEMS /
|c edited by Atul Tiwari and Baldev Raj.
|
264 |
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1 |
|a Hoboken, New Jersey :
|b John Wiley & Sons ;
|a Salem, Massachusetts :
|b Scrivener Publishing,
|c 2015.
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300 |
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|a 1 online resource
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|a text
|b txt
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|a computer
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|a online resource
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|a Materials degradation and failures series
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|a Includes bibliographical references and index.
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|a Print version record and CIP data provided by publisher.
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|a Half Title page -- Title page -- Copyright page -- Preface -- Chapter 1: Carbon as a MEMS Material -- 1.1 Introduction -- 1.2 Structure and Properties of Glassy Carbon -- 1.3 Fabrication of C-MEMS Structures -- 1.4 Integration of C-MEMS Structures with Other Materials -- 1.5 Conclusion -- References -- Chapter 2: Intelligent Model-Based Fault Diagnosis of MEMS -- 2.1 Introduction -- 2.2 Model-Based Fault Diagnosis -- 2.3 Self-Tuning Estimation -- References -- Chapter 3: MEMS Heat Exchangers -- 3.1 Introduction
|
505 |
8 |
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|a 3.2 Fundamentals of Thermodynamics, Fluid Mechanics, and Heat Transfer3.3 MEMS Heat Sinks -- 3.4 MEMS Heat Pipes -- 3.5 Two-Fluid MEMS Heat Exchanger -- 3.6 Need for Microscale Internal Flow Passages -- Nomenclature -- Greek Alphabets -- Subscripts -- References -- Chapter 4: Application of Porous Silicon in MEMS and Sensors Technology -- 4.1 Introduction -- 4.2 Porous Silicon in Biosensors -- 4.3 Porous Silicon for Pressure Sensors -- 4.4 Conclusion -- References -- Chapter 5: MEMS/NEMS Switches with Silicon to Silicon (Si-to-Si) Contact Interface
|
505 |
8 |
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|a 5.1 Introduction5.2 Bi-Stable CMOS Front End Silicon Nanofin (SiNF) Switch for Non-volatile Memory Based On Van Der Waals Force -- 5.3 Vertically Actuated U-Shape Nanowire NEMS Switch -- 5.4 A Vacuum Encapsulated Si-to-Si MEMS Switch for Rugged Electronics -- 5.5 Summary -- References -- Chapter 6: On the Design, Fabrication, and Characterization of cMUT Devices -- 6.1 Introduction -- 6.2 cMUT Design and Finite Element Modeling Simulation -- 6.3 cMUT Fabrication and Characterization -- 6.4 Summary and Conclusions -- Acknowledgments -- References
|
505 |
8 |
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|a Chapter 7: Inverse Problems in the MEMS/NEMS Applications7.1 Introduction -- 7.2 Inverse Problems in the Micro/Nanomechanical Resonators -- 7.3 Inverse Problems in the MEMS Stiction Test -- Acknowledgment -- References -- Chapter 8: Ohmic RF-MEMS Control -- 8.1 Introduction -- 8.2 Charge Drive Control (Resistive Damping) -- 8.3 Hybrid Drive Control -- 8.4 Control Under High-Pressure Gas Damping -- 8.5 Comparison between Different Control Modes -- References -- Chapter 9: Dynamics of MEMS Devices -- 9.1 Introduction -- 9.2 Modeling and Simulation
|
505 |
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|a 9.3 Fabrication Methods9.4 Characterization -- 9.5 Device Failures -- Acknowledgments -- References -- Chapter 10: Buckling Behaviors and Interfacial Toughness of a Micron-Scale Composite Structure with a Metal Wire on a Flexible Substrate -- 10.1 Introduction -- 10.2 Buckling Behaviors of Constantan Wire under Electrical Loading -- 10.3 Interfacial Toughness between Constantan Wire and Polymer Substrate -- 10.4 Buckling Behaviors of Polymer Substrate Restricted by Constantan Wire -- 10.5 Conclusions -- Acknowledgments -- References
|
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|a ProQuest Ebook Central
|b Ebook Central Academic Complete
|
650 |
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|a Microelectromechanical systems
|x Design and construction.
|
650 |
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0 |
|a Nanoelectromechanical systems
|x Design and construction.
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650 |
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|a TECHNOLOGY & ENGINEERING
|x Mechanical.
|2 bisacsh
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|a Tiwari, Atul,
|e editor.
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700 |
1 |
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|a Raj, Baldev,
|d 1947-2018,
|e editor.
|
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|a Materials and failures in MEMS and NEMS (Text)
|1 https://id.oclc.org/worldcat/entity/E39PCFvhX6GhVtqWpTfPqRbwFq
|4 https://id.oclc.org/worldcat/ontology/hasWork
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|t Materials and failures in MEMS and NEMS.
|d Hoboken, New Jersey : John Wiley & Sons ; Salem, Massachusetts : Scrivener Publishing, 2015
|z 9781119083603
|w (DLC) 2015025146
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