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Microwave and Millimeter-Wave Electronic Packaging.
Packaging of electronic components at microwave and millimeter-wave frequencies requires the same level of engineering effort for lower frequency electronics plus a set of additional activities which are unique due to the higher frequency of operation. This resource presents you with the electronic...
| Clasificación: | Libro Electrónico |
|---|---|
| Autor principal: | |
| Formato: | Electrónico eBook |
| Idioma: | Inglés |
| Publicado: |
Norwood :
Artech House,
2013.
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| Temas: | |
| Acceso en línea: | Texto completo |
Tabla de Contenidos:
- Microwave and Millimeter-Wave Electronic Packaging; Contents; Preface; 1 Introduction; 1.1 Distributed Effects; 1.1.1 Distributed Effects in Lumped Elements; 1.1.2 Undesired Resonances; 1.1.3 Transmission Lines ; 1.1.4 Dispersion Effects; 1.1.5 Coupling and Cross-Talk Between Signal Lines; 1.1.6 Parasitic and Grounding Concerns; 1.2 Thermal Effects; 1.3 First-Level Interconnects; 1.4 Second-Level Interconnects; 1.5 Modules; 1.6 Conclusions; Questions; References; 2 Materials; 2.1 Electrical Parameters and Their Measurement; 2.1.1 Dielectric Constant; 2.1.2 Loss Tangent.
- 2.1.3 Measurement of Dielectric Constants and Loss Tangents2.1.4 Metal Electrical Conductivity ; 2.2 Mechanical Parameters; 2.2.1 Thermal Conductivity; 2.2.2 Thermal Expansion; 2.2.3 Stress and Strain; 2.2.4 Young's Modulus; Questions; References; 3 Ceramic Packaging; 3.1 History of Ceramics; 3.2 Thin-Film Ceramics; 3.3 Advanced Thin-Film Techniques.