Cargando…
Microwave and Millimeter-Wave Electronic Packaging.
Packaging of electronic components at microwave and millimeter-wave frequencies requires the same level of engineering effort for lower frequency electronics plus a set of additional activities which are unique due to the higher frequency of operation. This resource presents you with the electronic...
| Clasificación: | Libro Electrónico |
|---|---|
| Autor principal: | |
| Formato: | Electrónico eBook |
| Idioma: | Inglés |
| Publicado: |
Norwood :
Artech House,
2013.
|
| Temas: | |
| Acceso en línea: | Texto completo |
MARC
| LEADER | 00000cam a2200000Mu 4500 | ||
|---|---|---|---|
| 001 | EBOOKCENTRAL_ocn905527317 | ||
| 003 | OCoLC | ||
| 005 | 20240329122006.0 | ||
| 006 | m o d | ||
| 007 | cr mn|---||||| | ||
| 008 | 150303s2013 xx o 000 0 eng d | ||
| 040 | |a AU-PeEL |b eng |e pn |c STF |d OCLCQ |d EBLCP |d OCLCQ |d ZCU |d MERUC |d STF |d ICG |d OCLCO |d OCLCF |d OCLCQ |d OCLCO |d AU@ |d OCLCQ |d DKC |d OCLCQ |d HS0 |d OCLCO |d OCLCQ |d OCLCO |d OCLCL | ||
| 019 | |a 1388675065 | ||
| 020 | |a 9781608076970 |q (print) | ||
| 020 | |a 1608076970 |q (print) | ||
| 020 | |a 9781608076987 |q (electronic bk.) | ||
| 020 | |a 1608076989 |q (electronic bk.) | ||
| 029 | 1 | |a DEBBG |b BV044050416 | |
| 029 | 1 | |a AU@ |b 000068423965 | |
| 035 | |a (OCoLC)905527317 |z (OCoLC)1388675065 | ||
| 050 | 4 | |a TK7870.15 |b .S787 2014 | |
| 072 | 0 | |a TEC024000 | |
| 082 | 0 | 4 | |a 621.381046 |2 23 |
| 049 | |a UAMI | ||
| 100 | 1 | |a Sturdivant, Rick. | |
| 245 | 1 | 0 | |a Microwave and Millimeter-Wave Electronic Packaging. |
| 260 | |a Norwood : |b Artech House, |c 2013. | ||
| 300 | |a 1 online resource (281 pages) | ||
| 336 | |a text |b txt |2 rdacontent | ||
| 337 | |a computer |b c |2 rdamedia | ||
| 338 | |a online resource |b cr |2 rdacarrier | ||
| 505 | 0 | |a Microwave and Millimeter-Wave Electronic Packaging; Contents; Preface; 1 Introduction; 1.1 Distributed Effects; 1.1.1 Distributed Effects in Lumped Elements; 1.1.2 Undesired Resonances; 1.1.3 Transmission Lines ; 1.1.4 Dispersion Effects; 1.1.5 Coupling and Cross-Talk Between Signal Lines; 1.1.6 Parasitic and Grounding Concerns; 1.2 Thermal Effects; 1.3 First-Level Interconnects; 1.4 Second-Level Interconnects; 1.5 Modules; 1.6 Conclusions; Questions; References; 2 Materials; 2.1 Electrical Parameters and Their Measurement; 2.1.1 Dielectric Constant; 2.1.2 Loss Tangent. | |
| 505 | 8 | |a 2.1.3 Measurement of Dielectric Constants and Loss Tangents2.1.4 Metal Electrical Conductivity ; 2.2 Mechanical Parameters; 2.2.1 Thermal Conductivity; 2.2.2 Thermal Expansion; 2.2.3 Stress and Strain; 2.2.4 Young's Modulus; Questions; References; 3 Ceramic Packaging; 3.1 History of Ceramics; 3.2 Thin-Film Ceramics; 3.3 Advanced Thin-Film Techniques. | |
| 520 | |a Packaging of electronic components at microwave and millimeter-wave frequencies requires the same level of engineering effort for lower frequency electronics plus a set of additional activities which are unique due to the higher frequency of operation. This resource presents you with the electronic packaging issues unique to microwave and millimeter-wave frequencies and reviews lower frequency packaging techniques so they can be adapted to higher frequency designs. You are provided with 30 practical examples throughout the book, as well as three free downloadable software analysis programs. | ||
| 590 | |a ProQuest Ebook Central |b Ebook Central Academic Complete | ||
| 650 | 0 | |a Microelectronic packaging. | |
| 650 | 6 | |a Mise sous boîtier (Microélectronique) | |
| 650 | 7 | |a Microelectronic packaging |2 fast | |
| 758 | |i has work: |a Microwave and millimeter-wave electronic packaging (Text) |1 https://id.oclc.org/worldcat/entity/E39PCFCpMQYrV6xcTcv687krHK |4 https://id.oclc.org/worldcat/ontology/hasWork | ||
| 776 | 1 | |z 9781608076970 | |
| 856 | 4 | 0 | |u https://ebookcentral.uam.elogim.com/lib/uam-ebooks/detail.action?docID=1579692 |z Texto completo |
| 938 | |a ProQuest Ebook Central |b EBLB |n EBL1579692 | ||
| 994 | |a 92 |b IZTAP | ||