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Hermeticity testing of MEMS and microelectronic packages /
Packaging of microelectronics has been developing since the invention of the transistor in 1947. With the increasing complexity and decreasing size of the die, packaging requirements have continued to change. A step change in package requirements came with the introduction of the Micro-Electro-Mecha...
| Clasificación: | Libro Electrónico |
|---|---|
| Autores principales: | , |
| Formato: | Electrónico eBook |
| Idioma: | Inglés |
| Publicado: |
Boston :
Artech House,
[2013]
|
| Colección: | Artech House integrated microsystems series.
|
| Temas: | |
| Acceso en línea: | Texto completo |
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